Multi-Structure Platen for Ion Implantation Charge Dissipation
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Solution Overview
Problem
Existing semiconductor platens with single grounding structures are ineffective for workpieces with varying back surface coatings, such as native oxide, grown oxide, and nitride layers, as they fail to provide optimal charge dissipation due to differences in coating thickness and type.
Innovation Solution
A platen with multiple types of grounding structures, including pins, flat-end posts, and mushroom-shaped structures, which can be mechanically biased or actuated to contact the workpiece surface, allowing for optimal charge dissipation based on the specific coating type and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single type of grounding structure is used on the platen, then the device complexity is reduced, but the adaptability to different workpiece back surface coatings is insufficient
Solution Approach 1:
The grounding system is segmented into multiple independent grounding structures (grounding pins, grounding posts, mushroom-shaped grounding structures) that can be selectively activated. Each grounding structure type is designed to handle specific coating conditions, allowing the system to adapt to different workpiece back surface coatings without requiring a complete redesign for each coating type.
Solution Approach 2:
The grounding structures are made dynamically controllable through actuators that can independently raise or lower each grounding structure based on the detected coating type and thickness. This dynamic adjustment capability allows the system to optimize grounding contact for each specific workpiece configuration, transitioning from a static single-type grounding system to a dynamic multi-type system.
2Adaptability or versatility
If multiple grounding structures are added to the platen, then the adaptability to different workpiece types improves, but the device complexity increases
Solution Approach 1:
Multiple grounding structure types are integrated into a single platen device, creating a universal grounding system that can handle various workpiece back surface coatings (native oxide, grown oxide, nitride layers, or no coating). Each grounding structure type serves a specific function for different coating scenarios, but all are controlled through a unified actuator system that manages the complexity centrally.
3Reliability
If grounding pins with tapered ends are used, then the ability to penetrate through coatings is improved, but the effectiveness for workpieces with thick insulating layers is reduced
Solution Approach 1:
Different grounding structure types with distinct local characteristics are deployed: grounding pins with tapered ends for penetrating thin or no coatings, grounding posts with flat ends for contacting workpieces with moderate coatings, and mushroom-shaped grounding structures with large contact areas for workpieces with thick insulating layers. Each structure's local geometry is optimized for specific coating conditions, and the system selects the appropriate structure type based on the detected workpiece characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of multiple grounding structures ensures effective charge dissipation across workpieces with diverse back surface coatings, improving the ion implantation process by ensuring proper contact and minimizing resistance, regardless of the coating type or thickness.
Implementation Method 1
In one embodiment, all of the different grounding structures are mechanically biased upward, such as by springs, from the surface of the platen such that all may contact the back surface of a workpiece disposed on the platen
Implementation Method 2
In another embodiment, one or more actuators are used to lift and lower subsets of the grounding structures such that only a subset of the grounding structures contacts the back surface of the workpiece
Implementation Method 3
The platen also serves to remove any charge that collects on the surface of the workpiece during the implantation process
Implementation Method 4
grounding structures, typically in the form of grounding pins, are used to remove this charge from the workpiece. These pins, which may be grounded
Data Source
AI summary
A platen having different grounding structures is disclosed. Different grounding structures, such as pins, flat-end posts and mushroom-shaped grounding structures, may be disposed on the surface of a platen. Each type of grounding structure may be advantageously used with a particular type of workpiece. In one embodiment, all of the different grounding structures are mechanically biased upward, such as by springs, from the surface of the platen such that all may contact the back surface of a workpiece disposed on the platen. In another embodiment, one or more actuators are used to lift and lower subsets of the grounding structures such that only a subset of the grounding structures contacts the back surface of the workpiece. These subsets may be all a single type of grounding structure, or may be associated with a particular type of workpiece.