Multi-submodule Semiconductor Package Thermal Management
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Solution Overview
Problem
Current power devices face challenges in thermal performance and reliability, particularly when operating at high temperatures, which affects their failure rates and efficiency in applications like hybrid and electric vehicles.
Innovation Solution
A multi-submodule package design is introduced, featuring dual-sided cooling through an inter-module layer that thermally and electrically couples semiconductor dies and spacers across submodules, allowing for improved thermal management and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power devices are operated at high temperatures to increase power output, then power output is improved, but thermal performance deteriorates and failure rates increase
Solution Approach 1:
The package is divided into multiple submodules (first submodule, second submodule, etc.), each containing semiconductor dies mounted on separate substrates. This segmentation allows independent thermal management for each submodule, enabling high power operation while maintaining thermal performance and reliability through distributed heat dissipation paths.
2Power
If multiple semiconductor devices are integrated in a single package to increase power density, then power output is improved, but thermal management becomes more difficult
Solution Approach 1:
The patent employs a three-dimensional stacked architecture where submodules are arranged vertically with spacers providing separation. This dimensional arrangement creates independent thermal zones for each submodule while maintaining compact packaging, allowing efficient thermal management through vertical heat dissipation paths and separate cooling channels for each layer.
Solution Approach 2:
Spacers are introduced as intermediary elements between submodules, providing both mechanical separation and thermal isolation. These spacers enable independent thermal management of each submodule while maintaining structural integrity, allowing high power density through multiple devices without compromising thermal performance.
3Stability of the object's composition
If substrates are rigidly fixed to ensure structural stability, then structural stability is improved, but package warpage increases due to thermal expansion
Solution Approach 1:
The patent employs spacers with flexible or compliant structures that can accommodate thermal expansion and contraction of substrates during temperature cycling. These spacers maintain structural stability while allowing controlled deformation, preventing package warpage by absorbing thermal stresses through their compliant nature.
4Temperature
If spacers are used to separate submodules for thermal management, then thermal performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The spacers are designed with optimized thickness parameters that provide sufficient thermal isolation between submodules while accommodating normal manufacturing variations. By carefully selecting spacer thickness within a specific range, the patent achieves effective thermal management without requiring extreme manufacturing precision, balancing thermal performance with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-submodule package enhances thermal management, reduces package warpage, and provides a wider tolerance for thickness dimensions, leading to improved reliability and performance in high-power applications such as automotive systems.
Implementation Method 1
an inter-module layer that thermally and electrically couples semiconductor dies and spacers across submodules
Implementation Method 2
an inter-module layer that thermally and electrically couples semiconductor dies and spacers across submodules
Data Source
AI summary
In one general aspect, a package can include a first submodule including a first semiconductor die coupled to a first substrate and a first spacer, and disposed between the first spacer and the first substrate. The first submodule includes a second spacer disposed lateral to the first semiconductor die. The package includes a second submodule including a second semiconductor die coupled to a second substrate and a third spacer, and disposed between the third spacer and the second substrate. The second submodule includes a fourth spacer disposed lateral to the second semiconductor die. The package includes an inter-module layer disposed between the first submodule and the second submodule. The first spacer of the first submodule is electrically coupled to the fourth spacer of the second-submodule via the inter-module layer. The second spacer of the first submodule is electrically coupled to the third spacer of the second-submodule via the inter-module layer.