Multi-Substrate Current Sensor for Tight Conductor Pitch
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Solution Overview
Problem
Current current measurement systems face challenges in measuring currents in multiple conductors with close proximity, as they require a significant pitch between conductors to accommodate current measurement coils, which compromises measurement sensitivity.
Innovation Solution
The current sensor assembly employs multiple current measurement coils distributed across multiple printed circuit boards or substrates, with strategically placed openings allowing conductors to pass through, enabling a smaller conductor pitch while maintaining measurement sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If current measurement coils are used to measure currents in multiple conductors, then measurement sensitivity is improved, but conductor pitch increases
Solution Approach 1:
The patent transitions from a single-plane coil arrangement to a three-dimensional multi-substrate configuration. Current measurement coils are distributed across multiple substrates stacked in the vertical dimension, allowing conductors to pass through openings in each substrate. This spatial reorganization enables smaller conductor pitch while maintaining adequate coil dimensions for measurement sensitivity.
Solution Approach 2:
The current measurement system is segmented into multiple independent substrates, each carrying specific current measurement coils. This segmentation allows the coils to be strategically positioned around conductors at different vertical levels, optimizing both measurement sensitivity and conductor spacing without requiring a single large planar area.
2Area of stationary object
If conductor pitch is reduced to accommodate closer conductors, then device compactness is improved, but measurement sensitivity deteriorates
Solution Approach 1:
By utilizing the vertical dimension with multiple stacked substrates, the patent achieves compact horizontal footprint while preserving measurement sensitivity. The current measurement coils maintain adequate radii by wrapping around conductors at different vertical levels rather than competing for horizontal space.
Solution Approach 2:
The patent implements a nested arrangement where multiple substrates with openings are stacked vertically, with conductors passing through aligned openings in sequence. This nesting enables compact device footprint while maintaining sufficient space for current measurement coils to wrap around conductors at different levels.
3Device complexity
If multiple current measurement coils are implemented on a single substrate, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the current measurement system into multiple separate substrates, each carrying one or more current measurement coils. This segmentation simplifies the manufacturing process for each individual substrate compared to implementing all coils on a single large substrate, while reducing the overall precision requirements for coil placement and conductor alignment.
Solution Approach 2:
By distributing coils across multiple substrates in the vertical dimension, the patent reduces the horizontal space requirements and simplifies the manufacturing of each substrate. The multi-layer configuration allows for more relaxed tolerance requirements compared to fitting all coils on a single plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for tighter conductor pitches while maintaining acceptable measurement sensitivity, as the current measurement coils can have larger radii and fewer substrate interconnects, reducing noise and improving accuracy.
Implementation Method 1
Rate of change of current sensors include current measurement coils to detect changes in a magnetic field generated by a current carrying conductor
Data Source
AI summary
A current sensor assembly is provided which includes a first substrate or PCB including two current measurement coils and a second substrate or PCB which includes at least one current measurement coils. The arrangement across multiple substrates or PCBs allows current carrying conductors to be positioned in close proximity, reducing the overall size of the assembly.