Multi-substrate Digital Lithography Carrier Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current maskless lithography systems are inefficient for processing multiple substrates simultaneously, particularly in semiconductor device packaging, due to their configuration for single-substrate processing, which is costly and impractical for smaller substrates.
Innovation Solution
A processing system with a substrate carrier and multiple optical modules, allowing for independent leveling and patterning of multiple substrates using a motion stage and Z-direction actuators, enabling simultaneous processing by generating patterning instructions based on offset information for each substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a processing system is configured to handle large area panels to achieve economies of scale, then processing efficiency for large panels is improved, but the system becomes prohibitively expensive and impractical for processing smaller substrates
Solution Approach 1:
The substrate carrier is divided into multiple carrier modules (e.g., 4 modules), each capable of independently holding and positioning a substrate. This segmentation allows the system to process multiple substrates simultaneously, achieving economies of scale for smaller substrates while maintaining the ability to handle large panels by using fewer modules or combining them differently.
Solution Approach 2:
The processing system is designed with a reconfigurable substrate carrier that can accommodate different substrate sizes and configurations. The same system infrastructure (optical modules, motion stage, control system) can process both large area panels and smaller substrates by adjusting the carrier module configuration, making the system universally applicable across different substrate types and sizes.
2Device complexity
If a processing system is designed for single substrate processing, then system complexity is reduced, but processing throughput decreases due to sequential processing requirements
Solution Approach 1:
Multiple carrier modules are merged onto a single motion stage, allowing multiple substrates to be processed simultaneously in one location. The optical modules can expose multiple substrates at once, and the motion stage moves all substrates together through the processing zone, combining the processing of multiple substrates into a single coordinated operation that increases throughput without proportionally increasing system complexity.
Solution Approach 2:
The system transitions from processing substrates sequentially in one dimension (time) to processing them simultaneously by adding a spatial dimension (multiple carrier modules arranged in space). This dimensional change allows parallel processing of multiple substrates while maintaining relatively simple system architecture through the use of identical, replicated modules.
3Productivity
If multiple substrates are processed simultaneously, then processing throughput increases, but the requirement for independent leveling and positioning of each substrate increases system complexity
Solution Approach 1:
Each carrier module is equipped with Z-direction actuators that perform preliminary leveling and positioning of substrates before the main exposure process. This preliminary action ensures that all substrates are properly positioned and focused on the optical modules, eliminating the need for complex real-time adjustment mechanisms during processing and simplifying the overall control system.
Solution Approach 2:
Each carrier module operates independently with its own Z-direction actuators for positioning and leveling, making the system self-regulating. Each module can adjust its substrate independently without requiring complex inter-module coordination, reducing the overall system control complexity while enabling simultaneous processing of multiple substrates at different positions and orientations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases substrate processing throughput, reduces cycle time, and lowers costs by enabling efficient simultaneous processing of multiple substrates, while allowing for easy conversion between multi-substrate and single-panel configurations.
Implementation Method 1
one or more lithography exposure sources, e.g., a UV light source, is used to direct and, or, focus radiation to, on, or below the surface of a photo-sensitive resist layer
Data Source
AI summary
Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.