Multi-Substrate Semiconductor Package With Spaced Adhesive Pad Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor device packages face challenges in enhancing electrical connections between substrates with different functions or pitches, which affect signal transmission performance.
Innovation Solution
A semiconductor device package design that includes a first substrate with a conductive pad and an adhesive layer, where the adhesive layer is spaced apart from the conductive pad to allow for the formation of a conductive via that electrically connects the substrates, reducing manufacturing complexity and improving electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the adhesive layer is disposed directly on the conductive pad to simplify manufacturing, then manufacturing complexity is reduced, but electrical connection reliability deteriorates due to potential adhesive contamination of the conductive pad
Solution Approach 1:
The adhesive layer is segmented into two distinct regions: a first adhesive region that contacts the conductive pad and a second adhesive region that is spaced apart from the conductive pad. This segmentation allows the first region to provide reliable electrical connection while the second region provides mechanical bonding without contaminating the conductive pad surface.
Solution Approach 2:
Different regions of the adhesive layer are assigned different functions: the first adhesive region near the conductive pad is optimized for electrical connection reliability with controlled spacing, while the second adhesive region is optimized for mechanical bonding strength. This local differentiation resolves the contradiction between ease of manufacture and electrical connection reliability.
2Reliability
If the adhesive layer is spaced apart from the conductive pad to improve electrical connections, then signal transmission performance is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive pad is formed on the first substrate before the adhesive layer is applied. This preliminary action establishes a reference structure that guides the subsequent adhesive layer formation, allowing the adhesive layer to be positioned with appropriate spacing from the conductive pad through standard manufacturing processes without requiring excessive precision.
Solution Approach 2:
The first adhesive region acts as an intermediary between the conductive pad and the second adhesive region, providing a transition zone that maintains electrical connection while enabling mechanical bonding. This intermediary structure reduces the precision requirements by distributing the positioning tolerance across multiple regions rather than requiring precise single-point spacing.
3Adaptability or versatility
If multiple substrates with different functions are connected to enhance device performance, then device functionality is improved, but electrical connection complexity increases
Solution Approach 1:
The adhesive layer structure serves multiple functions simultaneously: the first adhesive region provides electrical connection between substrates, the second adhesive region provides mechanical bonding, and the spaced-apart configuration provides electrical isolation. This multi-functionality allows multiple substrates with different functions to be connected without proportionally increasing electrical connection complexity.
Solution Approach 2:
The adhesive layer is extended in the lateral dimension to create a spaced-apart configuration between the conductive pad and the adhesive layer. This dimensional approach provides electrical isolation and connection pathways without increasing vertical complexity, allowing multiple functional substrates to be connected in a manageable manner.
Data Source
AI summary
The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.