Multi-Substrate Electronic Assembly With Fewer Connection Pads
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Solution Overview
Problem
The high manufacturing cost of electronic devices due to the large number of connection pads and joining times between different components on substrates, which increases production complexity and expense.
Innovation Solution
The electronic device design includes multiple substrates with driving circuits and connection pads, where the substrates are disposed on a third substrate, reducing the number of connection pads and bonding times through strategic placement of connection lines, thereby simplifying the manufacturing process and lowering costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different components are independently manufactured on different substrates and then joined, then production flexibility is improved, but manufacturing cost increases due to large number of connection pads and joining times
Solution Approach 1:
The electronic device is divided into multiple substrates (first substrate, second substrate, third substrate) that can be independently manufactured. Each substrate contains specific electronic components or driving circuits, allowing independent production and assembly while maintaining production flexibility.
Solution Approach 2:
Multiple substrates are combined onto a single third substrate through strategic placement and connection. This merging approach reduces the total number of separate joining operations needed compared to traditional multi-substrate assembly, thereby reducing manufacturing cost while preserving production flexibility.
2Device complexity
If the number of connection pads and joining times are reduced, then manufacturing cost is reduced, but production flexibility may be compromised
Solution Approach 1:
The patent transitions from a planar arrangement of multiple substrates to a three-dimensional configuration where first and second substrates are disposed on the third substrate. This dimensional change allows multiple substrates to be integrated with fewer connection pads and joining operations, reducing complexity while maintaining the ability to independently manufacture and assemble components.
3Adaptability or versatility
If multiple substrates are used for different components, then component manufacturing flexibility is improved, but device complexity increases
Solution Approach 1:
The third substrate serves multiple functions: it acts as a carrier for both the first and second substrates, provides connection pathways between them, and enables independent manufacturing of each substrate. This multi-functional design reduces overall device complexity while maintaining component manufacturing flexibility.
Data Source
AI summary
An electronic device including a plurality of electronic components, a first substrate, a second substrate, and a third substrate is provided. The first substrate includes a first driving circuit and a first connection pad. The second substrate includes a second driving circuit and a second connection pad, and the first connection pad is coupled to the second connection pad. The first substrate, the second substrate, and the plurality of electronic components are disposed on the third substrate.