Multi-Substrate Electronic Assembly With Shared Connection Lines
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Solution Overview
Problem
The high process cost of electronic devices is increased due to a large number of connection pads and bonding times when different elements are produced on separate substrates.
Innovation Solution
An electronic device configuration that includes multiple substrates with connection lines on the same layer, reducing the number of connection pads and bonding steps by integrating first and second substrates on a third substrate, thereby optimizing the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different elements are independently produced on different substrates and then bonded, then production flexibility is improved, but the number of connection pads and bonding times increases, leading to increased process cost
Solution Approach 1:
The electronic device is divided into multiple substrates (first substrate, second substrate, third substrate) that can be independently produced and then bonded together. Each substrate can be manufactured separately with specific process capabilities, allowing flexible production while maintaining modularity.
Solution Approach 2:
Multiple connection pads (first connection pad, second connection pad) are merged onto a single connection line on the third substrate. This reduces the number of separate connection interfaces needed, thereby reducing the number of bonding operations and connection pads required.
2Manufacturing precision
If multiple connection pads and bonding processes are used, then different process capability requirements are met, but production cost increases
Solution Approach 1:
Different substrates are produced independently to meet specific process capability requirements for different elements. This allows each substrate to be optimized for its specific manufacturing requirements while maintaining overall system integration.
Solution Approach 2:
The third substrate serves multiple functions by carrying both the first connection line and second connection line, and by providing mounting surfaces for multiple substrates. This multi-functionality reduces the total number of substrates and connection interfaces needed, lowering production cost.
3Ease of manufacture
If the number of connection pads and bonding times is reduced, then production cost is lowered, but design complexity increases
Solution Approach 1:
Multiple connection functions are merged onto the third substrate through shared connection lines. The first connection line couples the first connection pad and second connection pad, reducing the number of separate bonding interfaces while maintaining all necessary electrical connections.
Solution Approach 2:
The third substrate acts as an intermediary carrier that integrates multiple substrates and connection lines. This central hub approach simplifies the overall design by providing a single integration point for multiple components, reducing design complexity despite the reduced number of bonding interfaces.
Data Source
AI summary
An electronic device, including multiple electronic elements, a first substrate, a second substrate, and a third substrate, is provided. The first substrate includes a first device element and a first connection pad. The second substrate includes a second device element and a second connection pad. The third substrate includes a first connection line, wherein the first connection pad and the second connection pad are coupled to the first connection line, and the first substrate, the second substrate, and the electronic elements are disposed on the third substrate.