Multi-Substrate SIW Structure for Low-Loss High-Power Transmission
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Solution Overview
Problem
Microstrip and stripline transmission structures suffer from lower power handling capability and greater energy loss due to their small size, limiting their integration with planar circuits.
Innovation Solution
A substrate integrated waveguide (SIW) with multiple substrates, featuring metal-less areas and strategically arranged metal holes, allows for flexible signal transmission across stacked substrates, enhancing power handling and reducing energy loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If microstrip and stripline structures are used for signal transmission, then the size of electronic components is reduced, but the power handling capability decreases and energy loss increases
Solution Approach 1:
The patent transitions from planar microstrip/stripline transmission to three-dimensional waveguide structure by stacking multiple substrates vertically. The SIW structure utilizes the vertical dimension with metal layers and holes penetrating through stacked substrates, enabling waveguide-mode transmission that maintains compact footprint while achieving high power handling capability through the volumetric EM field distribution.
Solution Approach 2:
The patent employs composite construction by integrating multiple dielectric substrates with metal layers and metal holes to form a substrate integrated waveguide. This composite structure combines the advantages of planar integration with waveguide performance, achieving both compact size and high power handling through the synergistic combination of different materials and structural elements.
2Volume of moving object
If microstrip and stripline structures are used for signal transmission, then the size of electronic components is reduced, but energy loss increases
Solution Approach 1:
The patent transitions from planar microstrip/stripline transmission to three-dimensional waveguide structure by stacking multiple substrates vertically. The SIW structure utilizes the vertical dimension with metal layers and holes penetrating through stacked substrates, enabling waveguide-mode transmission that maintains compact footprint while achieving low energy loss through the volumetric EM field distribution and reduced surface current effects.
3Power
If traditional waveguide structure is used, then power handling capability and energy loss performance are improved, but integration with planar circuits becomes more difficult
Solution Approach 1:
The patent divides the waveguide structure into multiple discrete substrate layers, each with specific metal patterns and holes. This segmentation allows the waveguide to be constructed using standard PCB fabrication techniques, enabling modular assembly and integration with planar circuits while maintaining waveguide performance through the stacked configuration.
Solution Approach 2:
The patent merges waveguide transmission principles with planar circuit fabrication techniques by integrating metal layers, dielectric substrates, and holes into a unified substrate integrated waveguide structure. This merging enables traditional waveguide performance to be achieved using conventional planar manufacturing processes, facilitating easy integration with planar circuits.
4Loss of energy
If traditional waveguide structure is used, then energy loss is reduced, but integration with planar circuits becomes more difficult
Solution Approach 1:
The patent merges waveguide transmission principles with planar circuit fabrication techniques by integrating metal layers, dielectric substrates, and holes into a unified substrate integrated waveguide structure. This merging enables traditional waveguide low energy loss performance to be achieved using conventional planar manufacturing processes, facilitating easy integration with planar circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SIW with multiple substrates enables flexible circuit design by allowing signal transmission in the same or different directions, improving power handling and reducing energy loss.
Implementation Method 1
the electromagnetic wave is transmitted between the first substrate and the second substrate through the first metal-less area and the second metal-less area
Data Source
AI summary
A substrate integrated waveguide having multiple substrate comprises a first substrate and a second substrate stacked with the first substrate, wherein metal layers are formed on opposite sides of the first substrate and opposite sides of the second substrate, a plurality of metal holes are formed between two metal layers of the same substrate to limit transmission paths of electromagnetic waves transmitted in the substrate, and areas having no metal therein are formed between the first and second substrates so that the electromagnetic waves could be transmitted between the first and second substrates thereby.