Multi-Substrate Drying Layout Using Supercritical Fluid Transfer
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Solution Overview
Problem
Existing substrate processing systems face inefficiencies in processing multiple substrates simultaneously, particularly in drying processes where the accumulation and removal of drying liquids can lead to uneven patterns and potential collapse.
Innovation Solution
A substrate processing apparatus is designed with multiple first substrate processing devices for individual substrate processing and one or more second substrate processing devices for simultaneous processing of multiple substrates. A transfer unit facilitates the simultaneous transfer and processing of multiple substrates, utilizing supercritical fluids for efficient drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple substrates are processed sequentially in individual processing devices, then each substrate receives dedicated processing attention, but the overall processing speed and productivity are reduced
Solution Approach 1:
The patent merges multiple substrate processing operations into a single processing chamber where multiple substrates can be processed simultaneously. The processing device includes a chamber that can accommodate multiple substrates on a support table, allowing parallel processing of multiple wafers through the same cleaning and drying cycles, thereby dramatically improving throughput without requiring proportional increases in the number of separate processing devices.
Solution Approach 2:
The patent transitions from processing substrates in a single-file sequential manner to arranging multiple substrates in a two-dimensional array on the support table. This spatial reorganization allows multiple substrates to undergo processing operations simultaneously, effectively adding a dimensional aspect to the processing architecture and enabling parallel operations that were not possible in the sequential single-substrate configuration.
2Productivity
If drying liquid is supplied to multiple substrates simultaneously, then processing efficiency increases, but uneven drying patterns and potential substrate collapse may occur
Solution Approach 1:
The patent implements localized drying control by dividing the processing chamber into multiple zones, each with independent heating elements and gas supply systems. This allows different regions of the chamber to be optimized for specific drying requirements, ensuring uniform evaporation rates across all substrates regardless of their position on the support table, thereby preventing uneven drying patterns and pattern collapse.
Solution Approach 2:
The patent employs periodic drying cycles with alternating phases of liquid supply, heating, and gas flow. The drying process is conducted in multiple stages where parameters such as temperature, gas flow rate, and liquid supply timing are periodically adjusted to ensure uniform drying across all substrates. This periodic control prevents sudden uneven evaporation that could cause pattern collapse while maintaining high processing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances productivity by allowing simultaneous processing and drying of multiple substrates, reduces the risk of pattern collapse due to controlled drying, and minimizes equipment costs by optimizing the use of processing devices.
Implementation Method 1
a plurality of supercritical processing apparatuses that removes an anti-drying liquid (for example, IPA) remaining on the wafer after the cleaning processing by bringing the anti-drying liquid into contact with a supercritical processing liquid (for example, carbon dioxide)
Data Source
AI summary
A substrate processing apparatus includes multiple first substrate processing devices, one or more second substrate processing devices and a transfer unit. Each of the multiple first substrate processing devices is configured to process a substrate one by one. The one or more second substrate processing devices are configured to simultaneously process multiple substrates, which are processed in the multiple first substrate processing devices. The transfer unit is configured to simultaneously carry the multiple substrates, which are processed in the multiple first substrate processing devices, into a same second substrate processing device.