Multi-Surface Ceramic Shell for 3D Airtight Chip Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current ceramic packaging shells only encapsulate chips on the front and back surfaces, failing to meet the requirements of semiconductor device integration and miniaturization.
Innovation Solution
A multi-surface airtight packaging ceramic shell with a polyhedron ceramic body, featuring a shared solder pad on one surface and sealing rings on others, along with ceramic strips and metallized through-holes for bonding, allowing three-dimensional interconnection and multi-surface integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional two-surface ceramic packaging is used, then manufacturing simplicity is maintained, but packaging area is limited and device integration cannot meet miniaturization requirements
Solution Approach 1:
The patent transitions from traditional two-surface packaging to multi-surface packaging by utilizing the vertical dimension and side surfaces of the ceramic substrate. Multiple chips are packaged on different surfaces including front, back, and side surfaces, effectively converting a 2D packaging approach into a 3D multi-surface approach, thereby significantly increasing the total packaging area without proportionally increasing structural complexity
Solution Approach 2:
The patent implements nested packaging structures where chips are packaged within cavities formed on different surfaces of the ceramic substrate. The multi-surface packaging structure allows chips to be nested in a three-dimensional arrangement, with some chips packaged in cavities on the front surface, others on the back surface, and additional chips on side surfaces, maximizing space utilization and packaging density
2Productivity
If multi-surface packaging is implemented, then device integration and miniaturization are achieved, but manufacturing process complexity increases
Solution Approach 1:
The patent divides the packaging structure into multiple independent segments or modules, with each surface (front, back, sides) containing separate packaging cavities that can be independently designed and manufactured. This segmentation allows for modular assembly and simplifies the overall manufacturing process by breaking down the complex multi-surface packaging into manageable discrete units
Solution Approach 2:
The ceramic substrate serves multiple functions simultaneously: it acts as the base substrate, provides structural support, forms packaging cavities on multiple surfaces, and enables electrical interconnections through metallized through-holes. This multi-functionality reduces the need for additional separate components and simplifies the overall device architecture while achieving high integration
3Reliability
If multi-surface packaging with sealing rings is used, then airtight packaging is achieved on multiple surfaces, but manufacturing steps increase
Solution Approach 1:
The sealing rings are pre-formed and positioned on the ceramic substrate before the final packaging cavity formation. This preliminary placement ensures proper sealing positions are established early in the manufacturing process, and the sealing rings are integrated into the substrate structure before chip packaging, simplifying subsequent assembly steps while ensuring reliable airtight seals on all surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables airtight packaging on multiple surfaces, increasing packaging area and reducing module volume, supporting three-dimensional integration and miniaturization of semiconductor devices.
Implementation Method 1
the bonding finger pattern is connected to the shared solder pad through one or more metallized through-holes inside the ceramic body
Implementation Method 2
sintering and plating nickel, after printing the preset metallized pattern on the each surface of the multi-surface raw porcelain body, on the multi-surface raw porcelain body to form a ceramic body
Implementation Method 3
plating nickel on the one body to form a nickel-plated part
Data Source
AI summary
The present application provides a multi-surface airtight packaging ceramic shell, a multi-surface packaging device, and preparation method, belonging to the field of ceramic packaging technology. The multi-surface airtight packaging ceramic shell includes: a ceramic body, a shape of which is a polyhedron; where at least one surface of the ceramic body is provided with a shared solder pad, remaining surfaces other than the at least one surface having the shared solder pad are provided with sealing rings, and a packaging cavity for packaging a chip is formed inside each sealing ring. The ceramic body provided in the present application is a polyhedron, with one surface of shared solder pad as the bottom surface, and the other surfaces having chip mounting areas, bonding areas, and sealing rings.