Multi-Surface Heat Sink for Multi-Chip Packages
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Solution Overview
Problem
In electronic systems, thermal dissipation is inefficient due to the fixed spatial relationship between components and heat sinks, leading to suboptimal thermal resistance and increased temperatures, especially in Multi-Chip Packages (MCPs) with varying IC die heights and power densities.
Innovation Solution
A multi-surface heat sink with separate integrated heat spreaders for each component and flexible plate elements that accommodate different gap sizes, allowing independent optimization of Thermal Interface Materials (TIM) thicknesses to decouple thermal dissipation pathways and reduce thermal resistance across multiple IC dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a fixed spatial relationship is used between components and heat sink, then the structure is simple, but thermal dissipation efficiency deteriorates due to suboptimal thermal resistance
Solution Approach 1:
The heat sink base is divided into multiple independent surfaces at different heights, with each surface dedicated to a specific IC die. This segmentation allows each IC die to have an optimized thermal pathway to the heat sink, improving thermal dissipation efficiency while maintaining structural simplicity through the integrated heat spreader design.
Solution Approach 2:
Different regions of the heat sink base are designed with different heights to match the specific thermal requirements of each IC die. The integrated heat spreader is configured with local variations in thickness to accommodate varying gap sizes between the heat sink and different IC dies, optimizing thermal resistance locally for each component.
2Device complexity
If a single heat sink surface is used for multiple IC dies, then device complexity is reduced, but thermal resistance increases due to inability to optimize TIM thickness for each die
Solution Approach 1:
The heat sink base is segmented into multiple independent surfaces, each optimized for a specific IC die. This allows the Thermal Interface Material thickness to be independently optimized for each die-heat sink interface, reducing thermal resistance without requiring separate heat sink units for each component.
Solution Approach 2:
The heat sink base geometry is modified with different surface heights and the integrated heat spreader thickness is varied locally to accommodate different gap sizes. This parameter variation enables optimization of TIM thickness for each IC die, improving thermal resistance while maintaining a single integrated heat sink structure.
3Ease of manufacture
If varying IC die heights are accommodated with a fixed heat sink, then manufacturing is simplified, but thermal performance deteriorates due to suboptimal TIM layers
Solution Approach 1:
The heat sink base is divided into multiple surfaces at different heights to accommodate varying IC die heights. Each surface is optimized for thermal contact with its corresponding IC die, allowing the TIM layers to be compressed to optimal thicknesses for thermal performance while maintaining a single manufacturable heat sink component.
Solution Approach 2:
The integrated heat spreader is designed with local variations in thickness to match the different gap sizes created by varying IC die heights. This local quality adjustment ensures optimal TIM compression and thermal contact at each interface while keeping the heat sink manufacturing process simplified through integration.
4Loss of energy
If independent heat sinks are used for each IC die, then thermal dissipation is optimized, but device complexity and assembly difficulty increase
Solution Approach 1:
Multiple heat sink surfaces for different IC dies are merged into a single integrated heat sink base with varying surface heights. The integrated heat spreader combines multiple spreader functions into one component, achieving thermal dissipation optimization for each IC die while reducing device complexity and simplifying assembly compared to separate heat sinks.
Solution Approach 2:
The single heat sink base performs multiple thermal management functions simultaneously, with each surface optimized for a specific IC die. The integrated heat spreader serves multiple purposes: thermal spreading, gap accommodation, and TIM compression optimization, achieving universal thermal management for all IC dies in the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermal resistance and overall temperatures in MCPs by optimizing TIM thicknesses and accommodating varying IC die heights, resulting in improved thermal dissipation and mechanical integrity for components with different power densities.
Implementation Method 1
a plate element positioned above the first heat spreader; one or more spring elements positioned between the plate element and a first region of a bottom surface of the heat sink, the one or more spring elements being under a compressive load between the plate element and the heat sink
Implementation Method 2
one or more thermal conduit elements secured to both the plate element and the heat sink
Data Source
AI summary
An apparatus incorporating a multi-surface heat sink may comprise an integrated circuit die, a heat spreader, a plate element, and a heat sink. The heat spreader may be positioned above the IC die. The plate element may be positioned above the heat spreader. A bottom surface of the heat sink may have a first region positioned above the plate element. One or more spring elements may be positioned between the plate element and the first region of the bottom surface of the heat sink. The one or more spring elements may be under a compressive load between the plate element and the heat sink. One or more thermal conduit elements may be secured to both the plate element and the heat sink. The one or more thermal conduit elements may apply at least a part of the compressive load between the plate element and the heat sink.