Multi-Surface IC Contacts for 3D Printed Electronics
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Solution Overview
Problem
Integrated circuit devices are primarily designed for 2D environments and lack the structural adaptations necessary for effective use in 3D printed electronics, where they must withstand additive manufacturing conditions and provide flexible geometry and efficient connectivity on multiple surfaces.
Innovation Solution
The development of integrated circuit devices with electrical contacts on multiple surfaces, allowing for direct contact with conductive agents and non-soldered connections, and the use of passivation layers and dissolving topcoats to protect the contacts from environmental and thermal stresses, enabling their integration into 3D printed objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated circuit devices are designed for 2D environments with contacts on a single surface, then manufacturing and assembly are simplified, but connectivity and wiring efficiency in 3D printed electronics are limited
Solution Approach 1:
The patent transitions from 2D single-surface contacts to 3D multi-surface contacts by forming electrical contacts on multiple surfaces of the integrated circuit device, including opposite surfaces. This dimensional expansion enables enhanced connectivity and wiring efficiency in three-dimensional printed electronic assemblies.
Solution Approach 2:
The integrated circuit device is designed with universal multi-surface contact capability, allowing it to function effectively in both traditional 2D mounting and advanced 3D printed electronics applications. The device can establish electrical connections through multiple surfaces simultaneously, providing versatile connectivity options.
2Ease of manufacture
If integrated circuit devices are exposed to additive manufacturing conditions without protection, then manufacturing integration is achieved, but the contacts are damaged by environmental and thermal stresses
Solution Approach 1:
A protective coating is applied to the electrical contacts before the additive manufacturing process. This coating acts as a cushioning layer that protects the contacts from environmental contamination and thermal stresses during the manufacturing process, ensuring contact integrity survives the harsh manufacturing conditions.
Solution Approach 2:
The protective coating modifies the surface parameters of the electrical contacts, changing their chemical and physical properties to resist thermal oxidation and environmental degradation. This parameter change enables the contacts to withstand the high-temperature and chemically active environment of additive manufacturing.
3Reliability
If traditional soldered connections are used in 3D printed electronics, then reliable electrical contact is achieved, but flexibility and movement reduction are compromised
Solution Approach 1:
The patent extracts the soldering process from the connection method and replaces it with direct mechanical contact through multi-surface electrical contacts. This eliminates the need for solder joints, providing reliable electrical connection while maintaining the flexibility and movement characteristics required for 3D printed electronics.
Solution Approach 2:
The traditional mechanical-soldering system is replaced with a direct mechanical contact system. The electrical contacts establish reliable electrical connection through physical contact pressure and geometric alignment, substituting the chemical-bonding soldering process with a purely mechanical connection approach that preserves flexibility.
Data Source
AI summary
In one example in accordance with the present disclosure, an integrated circuit device is described. The integrated circuit device includes an integrated circuit die that includes a first surface and a second surface. A first electrical contact is disposed on the first surface of the integrated circuit die and a second electrical contact is disposed on the second surface of the integrated circuit die.