Multi-Surface Inductor for Misaligned NFC Communication

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Solution Overview

Problem

Current Near Field Communication (NFC) technologies face limitations in communication quality and distance due to the inflexibility in transmitter and receiver alignment, as they typically require parallel alignment for maximum power transfer, restricting their design and placement flexibility.

Innovation Solution

A semiconductor package device with conductive patterns on multiple surfaces, allowing for magnetic field transmission and reception in multiple directions, enhancing flexibility and communication quality even when the transmitter and receiver are misaligned.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conductive patterns are formed only on a single surface of the semiconductor package device, then the device structure is simple and manufacturing is easier, but the communication quality deteriorates and transmission errors increase due to misalignment between transmitter and receiver

Engineering Contradiction:
Improveease of manufactureVSAvoidcommunication quality
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent extends the conductive patterns from a single surface to multiple surfaces (top, bottom, and lateral surfaces) of the semiconductor package device. This multi-surface configuration enables magnetic field transmission in multiple directions, allowing the NFC device to maintain reliable communication even when transmitter and receiver are misaligned, thereby resolving the contradiction between manufacturing simplicity and communication reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If conductive patterns are formed on multiple surfaces of the semiconductor package device, then communication quality improves and flexibility increases, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvecommunication qualityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The semiconductor package device is designed with conductive patterns on multiple surfaces, enabling it to transmit and receive magnetic fields in multiple directions simultaneously. This multi-functional capability allows the single NFC device to adapt to various alignment scenarios and communication orientations, improving reliability without requiring multiple separate components, thus managing the complexity through functional integration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Device complexity

If traditional single-surface NFC design is used, then the device structure is simple, but the design flexibility and placement options are restricted due to parallel alignment requirements

Engineering Contradiction:
Improvedevice complexityVSAvoiddesign flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

By adding conductive patterns on lateral surfaces in addition to the top and bottom surfaces, the patent enables magnetic field transmission in multiple spatial dimensions. This allows the NFC device to be placed and oriented in various configurations without requiring strict parallel alignment, significantly improving design flexibility and placement options while maintaining manageable device complexity through integrated circuit board construction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The multi-surface design improves communication quality and flexibility in NFC devices by enabling magnetic field transmission in various directions, reducing transmission errors caused by misalignment.

Implementation Method 1

conductive patterns on multiple surfaces, allowing for magnetic field transmission and reception in multiple directions

Methodology Applied
Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Data Source

PatentUS10510660B2Semiconductor package devices integrated with inductor
Publication Date: 2019.12.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10510660B2 patent drawing
  • US10510660B2 patent drawing
  • US10510660B2 patent drawing

AI summary

The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.