Multi-Surface Semiconductor Package Design for Flexible Integration
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Solution Overview
Problem
Conventional semiconductor packages are often large, difficult to assemble, expensive to produce, and lack flexibility in system integration, making them challenging to connect in various orientations and integrate with other devices.
Innovation Solution
A packaged semiconductor device design featuring a semiconductor die with terminals on multiple surfaces, a leadframe portion electrically coupled to the die, and a molding compound, allowing for multiple connection options and reduced leadframe terminals, enabling smaller form factors and cost-effective manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional semiconductor packages are used, then they provide heat sinking advantages, but they are large, difficult to assemble, expensive to produce, and lack flexibility in system integration
Solution Approach 1:
The patent transitions from conventional two-terminal packages to multi-terminal packages with terminals distributed across multiple surfaces (top, bottom, sides). This dimensional expansion allows heat sinking functions to be distributed across multiple contact points and surfaces, improving thermal management while enabling smaller package footprints and greater design flexibility.
Solution Approach 2:
The patent creates a universal package structure that can serve multiple functions simultaneously: electrical connection through multiple terminals, heat sinking through distributed thermal paths, and mechanical mounting. The multi-surface terminal arrangement allows the same package to be used in various orientations and configurations, replacing multiple specialized packages with a single versatile design.
2Adaptability or versatility
If conventional semiconductor packages are used, then they provide established packaging structures, but they lack the ability to be connected in a variety of systems, orientations, and are difficult to integrate with other devices
Solution Approach 1:
The patent divides the package into multiple functional segments with terminals distributed across different surfaces and orientations. Each terminal or terminal group can be independently connected to different system components, allowing the package to be integrated into various system architectures and orientations without requiring different package designs.
Solution Approach 2:
By adding terminals on multiple surfaces (top, bottom, sides) rather than just two opposite faces, the patent expands the connection space from a simple two-point interface to a multi-dimensional connection array. This enables flexible routing and connection to multiple system components simultaneously.
3Ease of operation
If conventional semiconductor packages are used, then they provide standard packaging, but they are relatively large and difficult to assemble
Solution Approach 1:
The patent reduces package footprint by utilizing vertical and lateral space more efficiently through multi-surface terminal arrangements. Instead of requiring large planar areas for all connections, terminals are distributed across multiple surfaces, allowing compact packaging while maintaining all necessary connection points for assembly.
Solution Approach 2:
The patent enables dynamic orientation flexibility where the package can be mounted and connected in various orientations (upside down, sideways, different rotational positions) due to the distributed terminal arrangement. This dynamic adaptability simplifies assembly processes as the package can be oriented to match the most convenient assembly direction.
Data Source
AI summary
In one general aspect, a package can include a semiconductor die having a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die, a leadframe portion electrically coupled to the second terminal of the semiconductor die, and a molding compound. The first terminal on the first side of the semiconductor die, a first surface of the leadframe portion, and a first surface of the molding compound can define at least a portion of a first surface of the package. A second surface of the molding compound and a second surface of the leadframe portion can define at least a portion of a second surface of the package parallel to the first surface of the package, and the second surface can be on an opposite side of the package from the first surface of the package.