Multi-Tap Impedance Structure for Parasitic Ringing Suppression
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Solution Overview
Problem
Existing electronic package designs face challenges in efficiently suppressing parasitic ringing phenomena and improving electromagnetic interference (EMI) characteristics, particularly in miniaturized discrete high-voltage switch packages, where lead functionality is underutilized and ringing effects are pronounced.
Innovation Solution
The integration of a multi-tap impedance structure within the package, formed by interconnected bond wires or conductive elements, allows for selectable impedance values between electronic components and leads, effectively suppressing ringing and enhancing EMI performance by providing adjustable inductance and resistance values without increasing package size or complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If lead functionality is kept simple in miniaturized packages, then package size is reduced, but parasitic ringing phenomena increase
Solution Approach 1:
The patent applies multi-functionality by enabling leads to serve multiple purposes: they provide both electrical connection and integrated impedance control. The leads are designed with specific geometries and configurations that inherently provide damping inductance and resistance, allowing them to function as both interconnectors and ringing suppression elements simultaneously, thus addressing the contradiction between miniaturization and ringing suppression.
Solution Approach 2:
The patent merges the function of separate damping components into the lead structure itself. Instead of using discrete inductors or resistors connected to leads, the impedance-providing structure is integrated directly into the leads through specific geometrical configurations, material selections, and interconnections, combining multiple functions into a unified structure that reduces overall package size while suppressing ringing.
2Object-generated harmful factors
If impedance control is added to suppress ringing, then EMI performance improves, but device complexity increases
Solution Approach 1:
The patent employs parameter changes by modifying the physical and electrical parameters of the leads themselves. Through changes in lead geometry, material composition, cross-sectional area, length, and configuration, the intrinsic impedance characteristics are adjusted to provide optimal damping inductance and resistance values for ringing suppression, eliminating the need for additional complex impedance control components.
Solution Approach 2:
The leads are designed to self-provide the necessary impedance characteristics for ringing suppression through their own structural properties. The lead configuration, material selection, and dimensional parameters are optimized to inherently deliver the required damping inductance and resistance, allowing the leads to serve their own impedance control needs without external assistance or additional components.
3Adaptability or versatility
If multiple leads are used for impedance selection, then adaptability improves, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the lead structure into multiple discrete leads, each with specifically designed impedance characteristics. This segmentation allows different leads to provide different impedance values, enabling adaptability and selection of appropriate impedance for specific application requirements. The segmented lead design is manufactured as an integrated structure, maintaining manufacturing efficiency while providing versatile impedance options.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient suppression of parasitic ringing and improved EMI characteristics, allowing for compact and efficient electronic circuit design with adjustable impedance, thereby enhancing the performance and reliability of electronic packages.
Implementation Method 1
an impedance structure electrically coupling the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped
Data Source
AI summary
A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.