Multi-Temperature Accelerometer Calibration via Parallel Testing

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Solution Overview

Problem

The existing calibration techniques for integrated convective accelerometers are time-consuming, significantly reducing manufacturing test throughput due to the need for serial calibration and multiple temperature measurements.

Innovation Solution

A system and method that allows for parallel testing and calibration of multiple integrated sensors using multiple probe stations and oven chambers, enabling simultaneous temperature testing and programming of sensors, thereby improving manufacturing test throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If serial calibration and multiple temperature measurements are performed using existing techniques, then measurement precision is improved, but productivity deteriorates due to time-consuming calibration routines

Engineering Contradiction:
Improvecalibration accuracyVSAvoidmanufacturing test throughput
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The patent divides the calibration process into separate temperature point measurements (e.g., 25°C, 50°C, 75°C, 100°C) that can be performed in parallel across multiple probe stations rather than sequentially at a single station. Each probe station independently measures one temperature point, segmenting the overall calibration task into concurrent sub-tasks that collectively achieve the same precision while dramatically reducing total calibration time.

Inventive Principle:
Principle #1Segmentation

2Productivity

If multiple probe stations and oven chambers are used for parallel testing, then productivity is improved, but device complexity increases

Engineering Contradiction:
Improvemanufacturing test throughputVSAvoidsystem configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent employs identical probe stations and oven chambers that can serve multiple functions: each probe station with its oven chamber can independently handle any temperature point measurement, and the same hardware configuration is replicated across stations. This universal design allows flexible allocation of resources for parallel processing while maintaining standardized, manageable complexity through repetition of proven modules rather than inventing new complex systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly enhances the manufacturing test and calibration throughput of integrated sensors like convective accelerometers by allowing parallel testing and calibration across multiple temperatures, reducing the time required for calibration routines.

Implementation Method 1

integrated convective accelerometer comprising a convective acceleration sensor that includes a pair of temperature sensing elements disposed on opposing sides of a heater element

Methodology Applied
Scientific EffectThermal convection: Convection

Implementation Method 2

a pair of temperature sensing elements disposed on opposing sides of a heater element

Methodology Applied
Scientific EffectTemperature sensing: Thermocouple

Implementation Method 3

control circuitry operative to produce a control output for regulating the average output voltage, thereby regulating the temperature gradient of the heater element

Methodology Applied
Scientific EffectThermal regulation: Heat Exchanger

Implementation Method 4

a first oven chamber, a second oven chamber. Each oven chamber includes a support structure configured to support a plurality of integrated convective accelerometers

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS7461535B2Multi-temperature programming for accelerometer
Publication Date: 2008.12.09 MEMSIC
  • US7461535B2 patent drawing
  • US7461535B2 patent drawing
  • US7461535B2 patent drawing

AI summary

A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level. The offset temperature coefficient (OTC) of each sensor is calculated based upon the output offset measurements performed at the first and second temperature levels, and optimal settings for calibrating the respective sensors are determined based upon the calculated OTC values. After the temperature of the chuck is brought back down to the first specified level, the tester programs the output offset calibration settings into each sensor.