Multi-Terminal Connector Layout for Stable Conductive Adhesive Thickness

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Solution Overview

Problem

The thickness of conductive adhesive, such as solder, on semiconductor devices becomes thin due to the weight of wide connectors, complicating manufacturing and potentially leading to adhesive failure.

Innovation Solution

The first and second terminals are designed to extend in different directions, allowing them to be used as jig receivers, with adjustable heights to secure the conductive adhesive thickness, and sealed with resin to prevent thinning.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a connector having a large width is adopted to increase flowing current, then the current capacity is improved, but the conductive adhesive thickness becomes thin due to the heavy weight of the connector

Engineering Contradiction:
Improvecurrent capacityVSAvoidconductive adhesive thickness
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

The connector is divided into multiple terminals (first terminal, second terminal, third terminal, fourth terminal) that extend in different directions from the head part. This segmentation distributes the current load across multiple smaller contact points rather than requiring a single large-width connector, thereby reducing the overall weight while maintaining current capacity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The terminals extend in different directions (first direction, second direction, third direction, fourth direction) from the head part, utilizing three-dimensional spatial arrangement. This dimensional approach allows current to flow through multiple pathways in different orientations, effectively increasing current capacity without requiring a large planar width that would add excessive weight.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Power

If the connector width is increased to handle large-capacity current, then the current handling capability is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvecurrent handling capabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

Each terminal serves multiple functions: electrical connection for current flow, mechanical support structure, and positioning element during assembly. The terminals can be used as jig receivers for positioning the semiconductor element, eliminating the need for separate positioning fixtures and simplifying the manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The connector integrates multiple functional elements into a single structure: the head part houses multiple terminals that collectively provide current conduction, mechanical support, and positioning functions. This merging of functions into one component reduces the total number of parts and assembly steps compared to using a large-width connector with separate positioning mechanisms.

Inventive Principle:
Principle #5Merging (Combining)

3Power

If a large-width connector is used to increase current flow, then the current capacity is improved, but the conductive adhesive becomes thin and unreliable

Engineering Contradiction:
Improvecurrent capacityVSAvoidconductive adhesive reliability
Core Design Contradiction:
PowerVSReliability

Solution Approach 1:

The current path is segmented into multiple separate terminals rather than relying on a single large-width connector. This segmentation reduces the weight on any single conductive adhesive joint, maintaining adequate adhesive thickness and reliability while achieving the required current capacity through the combined effect of multiple terminals.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentEP3588554B1Electronic device, connector, and method for producing electronic device
Publication Date: 2024.10.09 SHINDENGEN ELECTRIC MANUFACTURING CO LTD
  • EP3588554B1 patent drawingFigure 1
  • EP3588554B1 patent drawingFigure 2
  • EP3588554B1 patent drawingFigure 3

AI summary

An electronic device has a sealing part 90, a first terminal 11 projecting outward from a first side surface of the sealing part 90, a second terminal 13 projecting outward from a second side surface different from the first side surface of the sealing part 90, an electronic element 95 provided inside the sealing part 90, and a head part 40 coupled to the first terminal 11 and the second terminal and connected to a front surface of the semiconductor element 95 via a conductive adhesive 75.