Multi-terminal inductor with segmented units for adjustable inductance
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Solution Overview
Problem
Existing integrated circuits face challenges in achieving optimal performance due to pre-designed inductors with fixed inductance values, which can be either too high or too low for specific applications, leading to increased resistance and inefficient use of space, and manufacturing costs are elevated when custom inductors are designed for each IC.
Innovation Solution
A multi-terminal inductor design featuring a plurality of inductor units with measurable inductance values, connected via a printed circuit board (PCB) to provide adjustable inductance options, allowing customers to configure the inductance according to their needs without requiring application-specific designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If pre-designed inductors with fixed inductance values are used, then manufacturing process is simplified, but inductance cannot be optimized for specific applications leading to increased resistance and inefficient space utilization
Solution Approach 1:
The inductor is divided into multiple discrete inductor units with different inductance values (e.g., first inductor unit, second inductor unit, third inductor unit). These segmented units can be selectively connected through conductive traces to achieve different total inductance values, resolving the contradiction between simplified manufacturing and adaptability.
Solution Approach 2:
A single inductor structure provides multiple inductance values through selective connection of inductor units. The inductor can function as different inductance values (e.g., first inductance value, second inductance value, third inductance value) depending on which units are connected, making it universally applicable to different circuit requirements without custom design.
2Adaptability or versatility
If custom inductors are designed for each IC, then inductance can be optimized for specific applications, but manufacturing costs are elevated
Solution Approach 1:
A single standardized inductor design provides multiple inductance values through selective connection of inductor units. This universal design can be manufactured using standard processes and then configured for different applications through selective connection, eliminating the need for custom designs for each application while maintaining inductance optimization.
Solution Approach 2:
The inductance value is changed by selecting different combinations of inductor units to connect. Instead of changing the physical structure or material parameters through custom design, the inductance is adjusted by changing which pre-fabricated units are connected, allowing optimization without increased manufacturing complexity or cost.
3Device complexity
If pre-designed inductors with fixed inductance values are used, then device complexity is reduced, but performance is compromised due to suboptimal inductance values
Solution Approach 1:
The inductor is segmented into multiple units that can be selectively connected. This segmentation allows the circuit to achieve optimal performance by selecting the appropriate combination of units for the specific application, while the overall structure remains relatively simple and can be manufactured using standard processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the functionality of integrated circuits by offering customizable inductance options, reducing manufacturing costs and improving operational efficiency by allowing customers to select the appropriate inductance values, thereby optimizing IC performance.
Implementation Method 1
An inductor is a passive element that stores electrical energy in a magnetic field when electric current flows through the inductor
Implementation Method 2
A first magnetic layer is arranged over an uppermost surface of the interconnect structure
Data Source
AI summary
A multi-terminal inductor and method for forming the multi-terminal inductor are provided. In some embodiments, an interconnect structure is arranged over a semiconductor substrate. A passivation layer is arranged over the interconnect structure. A first magnetic layer is arranged over the passivation layer, and a conductive wire laterally extends from a first input/output (I/O) bond structure at a first location to a second I/O bond structure at a second location. A third I/O bond structure branches off of the conductive wire at a third location between the first location and the second location. A connection between the third I/O bond structure and the first I/O bond structure has a first inductance. Alternatively, a connection between the first I/O bond structure and the second I/O bond structure has a second inductance different than the first inductance.