Multi-Tier Digital Beamforming for Higher Resolution RF Subarrays

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Solution Overview

Problem

Current telecommunications systems face challenges in efficiently distributing and processing beamformed signals across transceiver IC subarrays, leading to suboptimal beamforming resolution and increased quantization errors, which affect the quality of wireless communication signals.

Innovation Solution

A method and apparatus for multi-tier beamforming, where a first-tier beamformed frequency-domain IQ data packet is combined with selected second-tier beamformed frequency-domain IQ data packets at each transceiver IC subarray, using a digital signal processor to generate a discrete-time-domain signal and modulated RF signals, which are then transmitted via adjacent antenna element subarrays, allowing for enhanced beamforming resolution and reduced quantization errors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If beamformed signals are distributed across transceiver IC subarrays using current methods, then system complexity is reduced, but beamforming resolution deteriorates and quantization errors increase

Engineering Contradiction:
Improvesystem complexityVSAvoidbeamforming resolution
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The patent divides the beamforming process into two tiers: first-tier beamforming is performed at the transceiver IC subarray level with coarser resolution, while second-tier beamforming is performed at the individual transceiver IC level with finer resolution. This segmentation allows the system to maintain manageable complexity while achieving high beamforming resolution through the combination of both tiers.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a hierarchical dimension to the beamforming architecture by adding the second-tier beamforming layer at the transceiver IC level. This multi-dimensional approach (combining subarray-level and IC-level beamforming) enables the system to achieve high resolution without proportionally increasing overall system complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If beamformed signals are distributed across transceiver IC subarrays using current methods, then device simplicity is maintained, but quantization errors increase

Engineering Contradiction:
Improvedevice simplicityVSAvoidquantization errors
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent segments the beamforming function into two hierarchical levels, allowing quantization errors to be reduced at the second tier without requiring complete redesign of the entire system. The first tier handles coarse beamforming with simpler devices, while the second tier refines the beamforming with higher precision at individual ICs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the beamforming resolution parameter across different hierarchical levels. The first tier uses coarser beamforming parameters suitable for subarray-level processing, while the second tier uses finer beamforming parameters at the individual IC level, thereby reducing quantization errors without requiring uniformly high complexity across all devices.

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If multi-tier beamforming is implemented by combining first-tier and second-tier beamformed data, then beamforming resolution improves, but processing complexity increases

Engineering Contradiction:
Improvebeamforming resolutionVSAvoidprocessing complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent segments processing complexity across hierarchical levels: the first tier performs coarse beamforming at the subarray level with lower computational requirements, while the second tier performs fine beamforming at individual ICs. This segmentation distributes processing complexity rather than concentrating it, making the overall system more manageable.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary first-tier beamforming at the subarray level before second-tier beamforming at the individual IC level. This preliminary action reduces the dimensionality of the problem for the second tier, thereby reducing the processing complexity required at the finer resolution level.

Inventive Principle:
Principle #10Preliminary action

4Productivity

If first-tier beamformed data is forwarded from the first transceiver IC to additional transceiver ICs, then data distribution efficiency improves, but transmission overhead increases

Engineering Contradiction:
Improvedata distribution efficiencyVSAvoidtransmission overhead
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The patent segments data distribution into two tiers: first-tier beamformed data is distributed to multiple transceiver ICs for common processing, while second-tier beamformed data is distributed selectively to specific ICs. This segmentation reduces redundant transmission overhead by matching data distribution patterns to the hierarchical processing structure.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies partial forwarding of first-tier beamformed data to additional transceiver ICs based on specific processing requirements. Rather than forwarding all data to all ICs, the system selectively distributes data where needed, reducing transmission overhead while maintaining data distribution efficiency for necessary processing.

Inventive Principle:
Principle #16Partial or excessive action

Data Source

PatentUS20240007159A1Multi-Tier Digital Beamforming
Publication Date: 2024.01.04 INNOPHASE INC
  • US20240007159A1 patent drawing
  • US20240007159A1 patent drawing
  • US20240007159A1 patent drawing

AI summary

A method and apparatus for multi-tier beamforming are disclosed. The method includes receiving a first-tier beamformed frequency-domain IQ data packet and a plurality of second-tier beamformed frequency-domain IQ data packets at a transceiver integrated circuit (IC) subarray. Each transceiver IC of the transceiver IC subarray (i) forms a multi-tier beamformed frequency-domain IQ data set by combining beamformed frequency-domain IQ data from the first-tier beamformed frequency-domain IQ data packet with beamformed frequency-domain IQ data from selected ones of the second-tier beamformed frequency-domain IQ data packets, (ii) generates a discrete-time-domain signal from the multi-tier beamformed frequency-domain IQ data set, and (ii) generates a modulated radio frequency (RF) signal from the discrete-time-domain signal. The method further includes transmitting a multi-tier beamformed signal by transmitting respective modulated RF signals from the transceiver ICs of the transceiver IC subarray via a corresponding adjacent antenna element subarray.