Multi-Tier Conductive Post Carrier System for Semiconductor Packaging
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Solution Overview
Problem
Conventional semiconductor package structures face challenges in miniaturization, reliability, and cost efficiency, particularly in portable devices where large-scale IC packages need to be made smaller, thinner, and more reliable while maintaining high performance and packaging density.
Innovation Solution
A carrier system is developed with a carrier base featuring a recess and multiple conductive posts, where first and second barriers enhance connectivity and adhesion, allowing for the formation of conductive posts on the carrier base and within the recess, improving connectivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor package structures are used, then manufacturing simplicity is maintained, but miniaturization and packaging density are limited
Solution Approach 1:
The package structure is segmented into distinct functional zones: a recess region containing first conductive posts for electrical connections, and a surrounding region with second conductive posts for grounding or shielding. This segmentation allows independent optimization of each zone's function while achieving overall miniaturization.
Solution Approach 2:
The invention transitions from planar package layouts to three-dimensional structures by creating a recess in the carrier base and forming conductive posts at different vertical levels. This vertical dimensionality enables higher packaging density within a smaller footprint area.
2Volume of moving object
If package miniaturization is pursued, then device size is reduced, but reliability challenges increase
Solution Approach 1:
Different regions of the carrier base are assigned different local qualities: the recess region contains conductive posts with specific electrical connection properties, while the surrounding region contains conductive posts with grounding or shielding properties. This local differentiation optimizes reliability for each functional requirement while maintaining compact dimensions.
Solution Approach 2:
The carrier base acts as an intermediary structure between the semiconductor die and the external environment. It provides mechanical support, electrical connections, and shielding functions, thereby enhancing reliability while enabling miniaturization of the overall package.
3Reliability
If multi-tier conductive posts are implemented, then connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The recess is formed in the carrier base before the conductive posts are deposited. This preliminary action creates predetermined locations and depths for the multi-tier conductive posts, simplifying subsequent manufacturing steps and ensuring precise positioning for optimal connectivity.
Data Source
AI summary
A method of manufacture of a carrier system includes: providing a carrier base; forming a recess in the carrier base with the recess around a planar surface; forming a first barrier on the planar surface; forming a second barrier on the carrier base in the recess; forming a first post on the first barrier; and forming a second post on the second barrier.