Multi-Tier Optical Connector Layout for High-Density PIC Integration
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating optical and electrical components within devices for signal transmission and processing, particularly in creating effective multi-tier connectors for optical devices that support high beachfront density and efficient signal conversion.
Innovation Solution
A multi-tier connector system is developed, utilizing a photonic integrated circuit (PIC) with multiple active layers and metallization layers to integrate optical and electrical components, including optical waveguides, couplers, and semiconductor devices, using dielectric-to-dielectric and metal-to-metal bonding processes to create a robust and efficient optical package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If optical and electrical components are integrated within devices for signal transmission and processing, then signal transmission efficiency and device functionality are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The device is divided into distinct functional modules: optical components (waveguides, couplers) are integrated on a photonic integrated circuit substrate, while electrical components are mounted on a separate electrical substrate. These modules are then interconnected through a multi-tier connector system, allowing independent optimization of each module while achieving overall system functionality.
Solution Approach 2:
The patent employs a multi-tier connector architecture that extends the connection structure in the vertical dimension (z-axis), creating multiple bonding interfaces between optical and electrical substrates. This three-dimensional arrangement allows for high-density interconnections without increasing the horizontal footprint, effectively managing complexity through spatial organization.
2Quantity of substance
If multi-tier connectors are designed to support high beachfront density, then optical component integration density is improved, but manufacturing precision requirements increase
Solution Approach 1:
Alignment features and registration marks are pre-formed on the optical and electrical substrates before the bonding process. The multi-tier connector structure includes pre-positioned alignment pins and guide features that ensure precise registration during assembly, reducing the actual manufacturing precision demands during the bonding operation itself.
Solution Approach 2:
The patent introduces intermediary alignment structures and registration mechanisms that mediate between the optical and electrical substrates. These intermediary elements provide mechanical guidance and positional reference, enabling high-density integration while maintaining achievable manufacturing precision tolerances.
3Productivity
If photonic integrated circuits with multiple active layers are used to integrate optical and electrical components, then optical signal transmission capability is improved, but device fabrication complexity increases
Solution Approach 1:
The photonic integrated circuit is fabricated as a separate, self-contained module with multiple active optical layers formed through specialized photonic processing. This optical module is then integrated with the electrical substrate through the multi-tier connector system, allowing the complex photonic fabrication to be performed independently using established photonic manufacturing techniques.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.