Multi-Tier Power Terminal Layout for Dense Card Connectors
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Solution Overview
Problem
Miniaturization of electrical connectors poses challenges in maintaining the same number of power connections in reduced space, especially in high-power electrical systems requiring compact designs.
Innovation Solution
The development of high-density electrical connectors with multiple tiers of contacts arranged parallel to the card insertion edge, allowing for increased contact density without increasing the connector's width, and utilizing stacked conductive terminal layers with interleaved projections to form mounting tails for PCB attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the connector is miniaturized to reduce space, then the volume of the connector is reduced, but the number of power connections is reduced
Solution Approach 1:
The patent transitions from a conventional single-plane contact arrangement to a multi-tiered three-dimensional contact structure. Multiple tiers of contacts are stacked vertically within the connector housing, allowing power connections to be arranged in multiple layers. This vertical stacking enables increased connection density without increasing the connector's footprint area, effectively resolving the contradiction between miniaturization and maintaining connection quantity.
Solution Approach 2:
The patent implements nested contact structures where multiple tiers of contacts are positioned one above another within the same horizontal footprint. Each tier contains multiple contacts that are vertically stacked, creating a nested arrangement similar to dolls within dolls. This nesting approach maximizes the use of available space by utilizing the vertical dimension, allowing numerous power connections to coexist in a compact volume.
2Quantity of substance
If the contact density is increased to maintain connection quantity in smaller space, then the area occupied by contacts is increased, but the connector width must be increased
Solution Approach 1:
The patent resolves this contradiction by moving the contact arrangement from a two-dimensional planar layout to a three-dimensional multi-tiered structure. Contacts are organized into multiple vertical tiers, with each tier containing multiple contacts. This vertical stacking allows high contact density to be achieved within the same horizontal footprint, eliminating the need to increase connector width while maintaining or increasing the number of power connections.
3Quantity of substance
If multiple tiers of contacts are stacked to increase connection density, then the contact density is improved, but the manufacturing complexity is increased
Solution Approach 1:
The patent divides the contact structure into multiple discrete tiers, with each tier containing a set of contacts. This segmentation allows for modular manufacturing approaches where individual tiers or groups of tiers can be manufactured separately and then assembled into the final connector. The segmented structure simplifies the manufacturing process compared to attempting to create a monolithic multi-tiered structure, as each tier can be optimized and manufactured independently using standard fabrication techniques.
Data Source
AI summary
An electrical connector includes conductive terminals arranged to contact pads of a card inserted into the electrical connector. Each conductive terminal includes tiers of fingers configured to contact the card. The tiers of fingers include at least an outer tier of outer fingers and an inner tier of inner fingers. The outer tier may be parallel to the inner tier and may be parallel to a row direction. Contact surfaces of the outer fingers of the outer tier may be aligned in at least a first row parallel to the row direction. Contact surfaces of the inner fingers of the inner tier may be aligned in at least a second row different from and parallel to the first row. The conductive terminals may be arrayed along opposites sides of a card receiving slot so as to contact first and second sides of a card inserted into the slot.