Multi-Transducer Module Stacking for Compact Integration
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Solution Overview
Problem
Existing solutions for housing multiple transducers of different types in a single package face challenges in optimizing space without compromising performance, often requiring large packages and encountering technical difficulties due to differing space and connection needs.
Innovation Solution
A multi-transducer module is designed with a substrate and cap forming a package that integrates multiple MEMS transducers, including pressure and acoustic transducers, using a shared control chip and non-conductive glue coupling regions to optimize space and performance, allowing for efficient integration of various transducers within a compact package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple transducers of different types are housed in a single package, then space optimization is achieved, but technical difficulties arise due to different space and connection requirements of each transducer
Solution Approach 1:
The package is segmented into distinct cavities, each dedicated to housing a specific transducer type. This segmentation allows each transducer to have its own optimized space and connection pathways, eliminating interference between different transducer types while maintaining compact integration within a single package.
Solution Approach 2:
Different regions of the package are designed with locally optimized characteristics tailored to each transducer type's specific requirements. Each cavity provides the appropriate space, connectivity, and environmental conditions for its designated transducer, ensuring optimal performance without compromising other transducers in the package.
2Adaptability or versatility
If transducers are arranged side by side in a package, then multiple sensing functions are achieved, but the package dimensions increase proportionally
Solution Approach 1:
The package structure utilizes three-dimensional spatial arrangement with vertical stacking and multi-level cavities rather than simple planar side-by-side arrangement. This dimensional approach allows multiple transducers to be integrated in a compact footprint by exploiting the third dimension (height/depth), significantly reducing the package's planar area while maintaining all sensing functions.
3Volume of moving object
If transducers share the same package cavity, then space is optimized, but interference between transducers occurs
Solution Approach 1:
The internal cavity is divided into separate compartments, each housing a specific transducer type. This physical segmentation prevents acoustic, electromagnetic, or mechanical interference between transducers while maintaining efficient use of the overall package volume through compact cavity arrangement.
Solution Approach 2:
Acoustic or electromagnetic isolation structures serve as intermediaries between adjacent transducer cavities. These intermediary elements block unwanted signal transmission between transducers while allowing each transducer to function independently and reliably within its own optimized environment.
Data Source
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AI summary
A transducer modulus (11; 51; 61; 71; 81; 91), comprising: a supporting substrate (23); a cap (27), which is arranged on the supporting substrate and defines a chamber (8) therewith; a pressure transducer (12') in the chamber (8); an acoustic transducer (12") in the chamber (8); and a processing chip (22), or ASIC, operatively coupled to the pressure transducer (12') and to the acoustic transducer (12"). The pressure transducer (12') and the acoustic transducer (12") are arranged on top of one another to form a stack.