Multi-Tube Soldering Head for Faster Non-Wetting-Free Joining
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Solution Overview
Problem
Conventional soldering methods using tubular soldering irons are time-consuming and prone to solder non-wetting issues, especially when soldering multiple terminals to a wiring substrate with large heat capacity inner layers or lead wires, leading to low productivity and electrical failures.
Innovation Solution
A soldering device featuring multiple tubular solder piece guide tubes arranged within a first holding unit, which is heated by a heating unit, allowing for simultaneous soldering of multiple terminals and improved heat distribution to the wiring substrate, reducing solder non-wetting by increasing contact area and using materials resistant to solder wetting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single tubular soldering iron is used to solder terminals one by one, then solder scattering is suppressed and electrical short-circuit failures are prevented, but the soldering operation time becomes excessively long and productivity is low
Solution Approach 1:
The invention divides the single soldering function into multiple independent tubular soldering irons (first, second, third, and fourth soldering irons), each capable of soldering a specific terminal. This segmentation allows simultaneous soldering of multiple terminals, dramatically reducing operation time while maintaining the closed-space soldering mechanism that prevents solder scattering and electrical short-circuit failures.
Solution Approach 2:
The invention combines multiple tubular soldering irons into a single integrated soldering device that processes multiple terminals simultaneously. By merging the soldering functions into one device with coordinated multiple irons, it achieves both high productivity through parallel processing and high reliability through the maintained closed-space soldering mechanism for each terminal.
2Reliability
If a single tubular soldering iron is used, then solder scattering is suppressed, but the heat capacity of inner layers or lead wires causes iron tip temperature to drop, resulting in insufficient heat for the rear surface side and solder non-wetting
Solution Approach 1:
The invention segments the heating function by providing multiple independent heating units, each dedicated to a specific tubular soldering iron. This segmentation prevents heat competition between multiple irons and ensures that each iron maintains sufficient tip temperature even when soldering terminals with large heat capacity inner layers or lead wires, thereby preventing solder non-wetting while maintaining the closed-space mechanism that suppresses solder scattering.
Solution Approach 2:
The invention applies local quality by providing dedicated heating units positioned specifically for each tubular soldering iron, ensuring that each iron receives the precise heat it needs independently. This localized heating approach maintains optimal tip temperature at each soldering point, preventing solder non-wetting on the rear surface side while preserving the scattered solder prevention benefit of the closed-space design.
3Productivity
If multiple terminals are soldered simultaneously using multiple tubular soldering irons, then productivity is improved, but the device complexity increases
Solution Approach 1:
The invention applies universality by designing multiple tubular soldering irons with identical structures and functions, each capable of performing the same soldering operation on different terminals. This standardized multi-functional approach allows the device to handle multiple terminals simultaneously using replicated modular units, improving productivity while keeping the overall device complexity manageable through component standardization and modularity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device significantly shortens soldering operation time and suppresses solder non-wetting, ensuring efficient heat transfer and reliable bonding across multiple terminals, even with large heat capacity substrates, while maintaining cost-effectiveness and ease of material replacement.
Implementation Method 1
a heating unit which heats the first holding unit
Implementation Method 2
thread solder, which drops inside the tube and reaches a land, is heated and melted at a tip end portion of the tube
Data Source
AI summary
A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.