Multi-turning Substrate Side Wires for Narrow Bezel Protection
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Solution Overview
Problem
Conventional electronic devices with display panels face challenges in achieving narrow bezel designs that accommodate various size requirements while maintaining structural integrity and signal transmission efficiency.
Innovation Solution
The electronic device incorporates a substrate with multi-turning surfaces and side wires that extend continuously across these surfaces, supported by a protection structure formed by stacking protective layers, allowing for signal transmission and enabling the placement of functional components close to the edge, thus achieving a narrow bezel or bezel-less design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If side wires are extended to the side surface for narrow bezel design, then the bezel width is reduced, but the side wires become more vulnerable to damage and environmental factors
Solution Approach 1:
A protection structure comprising multiple protective layers is formed over the side wires extending to the side surface. These thin film protective layers shield the side wires from environmental factors and mechanical damage while allowing the wires to maintain their extended configuration for narrow bezel design. The protective layers conform to the contours of the side wires and substrate surfaces.
Solution Approach 2:
The protection structure is formed by stacking multiple protective layers in the vertical dimension, creating a multi-layered shielding system. This vertical stacking approach provides comprehensive protection without increasing the horizontal bezel width, as the protection is achieved through additional layers rather than lateral extension.
2Reliability
If protective layers are stacked to form the protection structure, then the side wires are better protected, but the manufacturing process becomes more complex
Solution Approach 1:
The protective layers are formed in a predetermined stacking sequence during the manufacturing process, with each layer being applied and positioned before the next layer is formed. This preliminary arrangement of protective layers simplifies the overall manufacturing process by establishing a clear fabrication roadmap, reducing the complexity of assembling pre-made components.
Solution Approach 2:
Multiple protective layers are nested one over another, with each layer conforming to and protecting the layers beneath it. This nested structure provides comprehensive protection while maintaining a compact configuration that does not significantly increase the overall device footprint or manufacturing complexity.
3Reliability
If the protection structure has varying thickness across different surfaces, then the side wires are optimally protected at each location, but the manufacturing precision requirements increase
Solution Approach 1:
The protection structure exhibits local quality by having different thicknesses at different locations: thicker at the side surface where side wires are most vulnerable, moderate at the main surface, and variable at turning surfaces. This localized thickness variation optimizes protection where needed most while managing manufacturing precision requirements through targeted rather than uniform protection.
Solution Approach 2:
The thickness parameter of the protective layers is varied across different locations on the substrate. By changing the thickness parameter locally rather than uniformly, the design achieves optimal protection at each location while the manufacturing process can control thickness within acceptable tolerances for each specific region.
Data Source
AI summary
An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.