Multi-Unit Chip Layout Without Scribe Lines for Higher Functional Density
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Solution Overview
Problem
The semiconductor industry faces challenges in scaling down integrated circuits (ICs) while maintaining manufacturing efficiency and reducing costs, as the complexity of processing and manufacturing increases with smaller geometries and more complex circuits.
Innovation Solution
The solution involves a chip with a substrate and multiple functional units, each with its own set of pads, including I/O, power, and ground pads, and a central management unit to store statuses, where chiplets are bonded to normal functional units using Cu—Cu bonding, allowing for efficient communication and management without scribe lines, and accommodating different sizes and types of units like memory and core units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of functional units and pads is increased to increase functional density, then productivity and functional density are improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The chip is divided into multiple independent functional units, each with its own set of pads. This segmentation allows each unit to be independently tested, packaged, and managed, reducing the overall complexity of processing and manufacturing while increasing functional density.
Solution Approach 2:
The patent transitions from traditional planar chip design to a three-dimensional stacked architecture where chiplets are bonded vertically on functional units. This dimensional change increases functional density without proportionally increasing planar manufacturing complexity.
2Productivity
If scaling down geometry size is implemented to increase production efficiency, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
By segmenting the chip into standardized functional units with uniform pad configurations, the patent enables modular manufacturing where precision requirements are distributed across identical repeating units rather than requiring high precision across the entire complex circuit.
Solution Approach 2:
The patent creates universal functional units that can be replicated and stacked multiple times. This universality allows standardized manufacturing processes to be applied repeatedly, maintaining precision requirements while increasing overall production efficiency.
3Adaptability or versatility
If multiple functional units with independent pads are implemented, then functional density and adaptability are improved, but device complexity increases
Solution Approach 1:
Each functional unit is segmented with its own dedicated pads, creating independent interfaces that simplify pad management. The central management unit tracks pad assignments systematically, transforming complexity into organized modularity.
Solution Approach 2:
The central management unit maintains real-time status information of all functional units and pads, providing feedback control for pad assignment and configuration. This systematic management reduces complexity through centralized coordination and tracking.
4Strength
If chiplets are bonded on functional units using Cu-Cu bonding, then joining strength and electrical conductivity are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses homogeneous Cu-Cu bonding materials and processes for all chiplet-to-functional-unit connections. This uniformity simplifies the bonding process and reduces precision requirements compared to using multiple different bonding technologies.
Solution Approach 2:
By dividing the chip into modular functional units with standardized pad layouts, the patent enables repetitive bonding operations with fixed alignment references, reducing the cumulative precision requirements compared to monolithic chip design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased functional density and efficiency by eliminating scribe lines, allowing for independent operation of functional units, efficient bonding, and effective management of both normal and failed units, thereby enhancing production efficiency and reducing costs.
Implementation Method 1
The chiplets are bonded on the normal functional units by a Cu—Cu bonding process
Data Source
AI summary
A chip includes a substrate and a plurality of functional units on the substrate, in which each of the functional units has its own set of pads. The functional units are physically connected and there is no scribe line passes through the chip. A semiconductor structure having the chip is also disclosed.