Multi-Wavelength Lithography Patterning for Single-Exposure Resolution
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Solution Overview
Problem
Existing photolithography processes require multiple masks and steps, leading to alignment errors and increased time and cost, as they struggle to meet the pattern resolution requirements of a single design layer.
Innovation Solution
A lithography apparatus and method that uses a substrate support, multiple wavelength light source, and image formation device to expose a reactive layer to different wavelengths, allowing for enhanced resolution lithography in a single operation without multiple masks or alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple masks and lithography steps are used to meet pattern resolution requirements, then manufacturing precision is improved, but device complexity and loss of time increase
Solution Approach 1:
The patent combines multiple lithography steps and masks into a single simultaneous operation. Multiple wavelength light sources illuminate different regions of the reactive layer at the same time, allowing multiple patterns to be formed in one exposure step rather than requiring sequential processing with multiple masks.
Solution Approach 2:
The patent introduces a spectral dimension by using multiple wavelengths of light simultaneously. Different regions of the reactive layer are exposed to different wavelengths, enabling multiple patterning operations to occur in parallel across the spectrum rather than requiring multiple temporal steps.
2Manufacturing precision
If multiple masks and lithography steps are used to meet pattern resolution requirements, then manufacturing precision is improved, but loss of time increases
Solution Approach 1:
The patent merges multiple sequential lithography steps into a single simultaneous exposure operation. By combining multiple wavelength light sources and directing them to different regions of the reactive layer at the same time, the process reduces the total number of steps and eliminates alignment time between multiple masks.
Solution Approach 2:
The patent maintains continuous useful action by performing multiple patterning operations simultaneously in a single exposure step. The multi-wavelength light sources operate concurrently, ensuring that the reactive layer receives all necessary exposures in one continuous operation rather than through interrupted sequential steps.
3Manufacturing precision
If multiple masks are used to meet pattern resolution requirements, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent eliminates the need for multiple mask alignments by combining all patterning operations into a single exposure step. The multi-wavelength light sources are simultaneously directed to different regions of the reactive layer, removing the alignment operations that would otherwise be required between sequential masks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces the need for multiple patterning steps and alignment, enabling efficient and cost-effective production of semiconductor devices with improved resolution.
Implementation Method 1
a light source system able to emit light at two or more wavelengths
Implementation Method 2
an image formation device able to receive the two or more wavelengths of light generated by the light source system and generate two or more light images at the two or more wavelengths received from the light source system
Implementation Method 3
The reactive material includes a first region and a second region. The image formation device is configured to allow a first wavelength of light onto the first region, and the image formation device is configured to allow a second wavelength of light onto the second region.
Data Source
AI summary
Embodiments of the present disclosure include a lithography apparatus, patterning system, and method of patterning a layered structure. The patterning system includes an image formation device and a reactive layer. The patterning system allows for creating lithography patterns in a single operation. The lithography apparatus includes the patterning system and an optical system. The lithography apparatus uses a plurality of wavelengths of light, along with the image formation device, to create a plurality of color patterns on the reactive layer. The method of patterning includes exposing the reactive layer to a plurality of wavelengths of light. The light reacts differently with different regions of the reactive layer, depending on the wavelength of light emitted onto the different regions. The method and apparatuses disclosed herein require only one image formation device and one lithography operation.