Multi-Wavelength Optical Inspection for Semiconductor Surface Analysis
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Solution Overview
Problem
Current semiconductor manufacturing processes lack efficient methods for rapid, high-resolution inspection of micro-areas and complex structures, which hinders yield and quality improvement due to the need for extensive manual inspection and potential errors in alignment and structural analysis.
Innovation Solution
A method utilizing a spatially resolved optical device that emits multi-wavelength light, generates wavelength-specific images, and extracts spectra from specific areas to analyze and predict 3D structures, align substrates, and correct light intensity distributions, enabling real-time inspection and alignment with high accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual inspection methods are used for semiconductor wafers, then inspection can be performed, but inspection speed is slow and productivity is reduced
Solution Approach 1:
The patent replaces manual mechanical inspection with an automated optical inspection system that uses light sources, lenses, and sensors to automatically detect defects on semiconductor wafers. This substitution of mechanical/manual inspection with optical automation directly increases inspection speed and reduces time loss while maintaining inspection quality.
2Measurement precision
If conventional optical inspection is used, then inspection can be performed, but resolution is insufficient for fine patterns and measurement precision deteriorates
Solution Approach 1:
The patent segments the inspection process into multiple optical paths with different magnifications and focuses. By dividing the inspection into coarse scanning and fine detection stages using separate optical systems, the patent achieves both high-speed overview and high-resolution fine pattern measurement, overcoming the limitation of conventional single-system optical inspection.
3Measurement precision
If high magnification is used for micro-area inspection, then measurement precision improves, but inspection area coverage decreases and productivity worsens
Solution Approach 1:
The patent implements a dynamic inspection system that automatically adjusts magnification and optical focus based on the inspection stage. The system dynamically switches between low-magnification wide-area scanning and high-magnification detailed inspection, optimizing both measurement precision for micro-areas and overall inspection throughput by adapting to different inspection requirements in real-time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for immediate error detection and optimal process conditions in semiconductor manufacturing by providing real-time inspection and alignment, enhancing the precision and efficiency of semiconductor device production.
Implementation Method 1
emitting multi-wavelength light toward a first measurement area of the substrate... using the light source to emit the multi-wavelength light and the objective lens to transmit the multi-wavelength light received from the light source
Data Source
AI summary
Provided are a method of inspecting a surface and a method of manufacturing a semiconductor device. The methods include preparing a substrate, selecting a spatial resolution of a first optical device by setting a magnification of an imaging optical system, emitting multi-wavelength light toward a first measurement area of the substrate and obtaining first wavelength-specific images, generating first spectrum data based on the first wavelength-specific images, generating first spectrum data of respective pixels based on the first wavelength-specific images, and extracting a spectrum of at least one first inspection area having a range of the first measurement area or less from the first spectrum data, and analyzing the spectrum. The first optical device includes a light source, an objective lens, a detector, and an imaging optical system. The obtaining first wavelength-specific images includes using the imaging optical system and the detector.