Multi-Wavelength Substrate Measurement in Lithography

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving precise and accurate lithography processes as the dimensions of integrated circuit components decrease, requiring high-resolution lithography that can handle smaller features without damage, and accurately determine substrate surface profiles for optimal alignment.

Innovation Solution

A substrate measuring device is integrated into the lithography projection apparatus, utilizing an emitter with multiple light sources of different wavelengths and optical fibers to detect variations in substrate height and surface profiles, enabling better prediction of the substrate's vertical position relative to the focal plane for improved alignment during the lithography exposure process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional single-wavelength light sources are used for substrate measurement, then the device complexity is lower, but the measurement precision and ability to determine substrate profile accurately deteriorates

Engineering Contradiction:
Improvesubstrate profile measurement precisionVSAvoidmeasuring device complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The measurement system is segmented into multiple independent light sources, each emitting at a different wavelength. This allows the system to measure different substrate layers and materials at different wavelengths simultaneously, improving measurement precision without requiring a single complex multi-functional device

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The measuring device is designed with multi-functionality by incorporating multiple light sources that can operate at different wavelengths. This universal design enables the same device to measure various substrate materials and profiles that would require different specialized devices, thereby improving measurement precision while managing complexity through integrated design

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If high-resolution lithography is implemented to achieve smaller feature dimensions, then the manufacturing precision improves, but the difficulty of detecting and measuring substrate characteristics increases

Engineering Contradiction:
Improvelithography feature dimension precisionVSAvoidsubstrate characteristic detection difficulty
Core Design Contradiction:
Manufacturing precisionVSDifficulty of detecting and measuring

Solution Approach 1:

The measurement system transitions from single-wavelength to multi-wavelength operation, adding a spectral dimension to the measurement process. This allows characterization of substrate materials and profiles at different depths and layers, making it easier to detect and measure substrate characteristics that would be difficult to resolve with conventional single-wavelength methods

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system changes the wavelength parameter of the light source to optimize measurement for different substrate materials and features. By selecting appropriate wavelengths from multiple light sources, the system can enhance contrast and detectability of specific substrate characteristics, thereby reducing measurement difficulty while maintaining high manufacturing precision

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If multiple light sources with different wavelengths are used in the substrate measuring device, then the measurement precision and substrate profile determination improve, but the device complexity increases

Engineering Contradiction:
Improvesubstrate height variation measurement precisionVSAvoidemitter and optical system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The optical system is segmented into multiple independent light source modules, each with its own optical path. This modular segmentation allows precise control and measurement at different wavelengths while managing system complexity through standardized module design and independent operation of each wavelength channel

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the accuracy and resolution of the lithography process by precisely determining the substrate's profile and alignment, ensuring that the substrate is optimally positioned within the focal plane, thereby improving imaging quality and process efficiency.

Implementation Method 1

The beams of light guided from the optical fiber(s) are then emitted to desired locations of the substrate

Methodology Applied
Scientific EffectOptical fiber transmission: Optical Fibre

Implementation Method 2

an emitter that provides multiple light sources having different wavelengths

Methodology Applied
Scientific EffectLight emission: Light

Implementation Method 3

a receiver that detects responses to the light having different wavelengths reflected from a substrate

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS12007691B2Substrate measuring device and a method of using the same
Publication Date: 2024.06.11 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US12007691B2 patent drawing
  • US12007691B2 patent drawing
  • US12007691B2 patent drawing

AI summary

Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.