Multi-Wavelength Substrate Temperature Measurement for Wafer Uniformity

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Solution Overview

Problem

As semiconductor elements become more integrated and pattern sizes miniaturized, managing substrate temperature uniformly across larger semiconductor wafers and photomasks becomes crucial for maintaining process yield, but existing technologies lack effective methods for precise temperature measurement and management.

Innovation Solution

A substrate temperature measuring device and method that uses a sensor unit to sense light of different wavelengths, calculate temperatures for each wavelength, and a calculation unit to determine emissivity and reflected energy, allowing for accurate substrate temperature calculation through the measured emissivity and energy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrate size is increased to improve productivity, then manufacturing output increases, but temperature uniformity across the substrate deteriorates

Engineering Contradiction:
Improvemanufacturing outputVSAvoidtemperature uniformity
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent segments the substrate surface into multiple measurement regions and uses multiple sensors to measure temperature at different locations simultaneously. This allows comprehensive temperature monitoring across the entire large substrate, enabling detection and correction of temperature non-uniformity while maintaining high productivity through large wafer processing.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If temperature measurement precision is improved through multiple wavelengths, then temperature accuracy increases, but device complexity increases

Engineering Contradiction:
Improvetemperature accuracyVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent employs a multi-wavelength pyrometer that can measure temperature across multiple wavelengths simultaneously using a single integrated device. This multi-functional approach enables accurate temperature measurement while compensating for emissivity variations and reflected energy, achieving high precision without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent changes the measurement parameter from single-wavelength to multi-wavelength detection. By measuring radiated energy at multiple wavelengths and using calculation units to determine temperature, emissivity, and reflected energy, the system achieves accurate temperature measurement that accounts for varying substrate properties without requiring complex hardware modifications.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If emissivity and reflected energy are calculated to improve measurement accuracy, then temperature measurement reliability increases, but calculation complexity increases

Engineering Contradiction:
Improvemeasurement reliabilityVSAvoidcalculation complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a feedback mechanism where the measurement system calculates emissivity and reflected energy based on multi-wavelength measurements, then uses these calculated parameters to refine the temperature determination. This iterative feedback process improves measurement reliability by accounting for substrate-specific properties while using systematic calculation methods to manage computational complexity.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the reliability and speed of substrate temperature measurement, ensuring uniform process conditions and enhancing semiconductor fabrication yield by providing precise temperature data across the substrate.

Implementation Method 1

a sensor unit which senses a first amount of light of a first light having a first wavelength, a second amount of light of a second light having a second wavelength, and a third amount of light of a third light having a third wavelength which are provided from a substrate

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 2

the first to third amounts of light each include an amount of emitted light emitted from the substrate and an amount of reflected light of light which is provided from the light source unit and reflected from the substrate

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS20240019311A1Substrate temperature measuring device, substrate processing apparatus including the same, and substrate temperature measuring method using the same
Publication Date: 2024.01.18 SAMSUNG ELECTRONICS CO LTD
  • US20240019311A1 patent drawing
  • US20240019311A1 patent drawing
  • US20240019311A1 patent drawing

AI summary

A substrate temperature measuring device includes a sensor which senses a first amount of light of a first light having a first wavelength, a second amount of light of a second light having a second wavelength, and a third amount of light of a third light having a third wavelength provided from a substrate, a first calculator to calculate a first temperature for the first wavelength, a second temperature for the second wavelength, and a third temperature of the wavelength through the first amount of light, the second amount of light and the third amount of light which are sensed, and a second calculator to calculate emissivity of the substrate and reflected energy of the substrate through the first temperature, the second temperature, and the third temperature, wherein a temperature of the substrate is calculated through the calculated emissivity of the substrate and the reflected energy of the substrate.