Multi-Width Copper Posts for Crack-Resistant Solder Joints
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Solution Overview
Problem
As copper posts on circuit boards decrease in width to enhance functionality, solder connections between the circuit board and motherboard are prone to cracking, necessitating a more robust and scalable solution.
Innovation Solution
Implementing semiconductor devices with first posts having a smaller width connected to second posts of a larger width, distributing the force and reducing strain on solder connections, thereby preventing cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the width of copper posts is decreased to enable additional functionality, then the functionality and density of the circuit board are improved, but the solder connection becomes prone to cracking and reliability deteriorates
Solution Approach 1:
The copper post structure is segmented into multiple portions with different widths along its length. The first portion has a narrower width to save space and enable additional functionality, while the second portion has a wider width to provide sufficient support area for the solder connection, preventing cracking. This segmentation allows each portion to serve its specific function optimally.
Solution Approach 2:
Different portions of the copper post have different local qualities in terms of width. The upper portion near the circuit board has a narrower width to increase density and functionality, while the lower portion near the solder joint has a wider width to enhance mechanical strength and solder attachment. This local variation in geometry optimizes both functionality and reliability.
2Volume of moving object
If the width of copper posts is decreased to reduce device size, then the form factor is reduced, but the solder connection strength is compromised
Solution Approach 1:
The copper post is divided into segments with different widths. The first segment has a reduced width to minimize device footprint and enable higher density, while the second segment maintains a larger width specifically for the solder connection region, ensuring adequate strength without increasing overall device size.
Solution Approach 2:
The copper post features localized width variation where only the solder attachment region has increased width, while the majority of the post structure remains narrow. This allows the device to maintain a compact form factor while having localized strength enhancement where it is most needed for solder connection reliability.
Data Source
AI summary
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including at least two posts having different widths. In an embodiment, a system can include a first substrate having a first layer comprising a first post having a first width and a second layer coupled to the first layer and comprising an external surface of the first substrate and a second post having a second width connected to the first post. The first width can be less than the second width. The system can further include a solder connected to the second post and configured to connect the second post to a first connector on a second substrate.