Multi-Wing Capacitor Design for High Density
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Solution Overview
Problem
Traditional multi-layer ceramic capacitors (MLCCs) fail to meet the increasing demands for small size and high capacity in modern electronic systems, limiting their capacitance density and performance in applications requiring miniaturization and high integration.
Innovation Solution
A capacitor design featuring a multi-wing structure with a laminated structure composed of alternating conductive and dielectric layers, where the conductive layers are electrically connected through external electrodes, enhancing capacitance density by increasing the surface area utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional multi-layer ceramic capacitors (MLCC) are used, then the device structure is simple and easy to manufacture, but the capacitance density is low and the device size cannot be sufficiently reduced
Solution Approach 1:
The patent transitions from traditional planar MLCC structure to a three-dimensional multi-wing structure with vertical stacking of conductive and dielectric layers. The multi-wing configuration extends the capacitor structure in multiple spatial dimensions, significantly increasing the effective surface area for capacitance formation without proportionally increasing the device footprint, thereby achieving high capacitance density in a compact volume
Solution Approach 2:
The patent implements nested structures where conductive layers and dielectric layers are alternately stacked within the multi-wing configuration. The laminated structure contains multiple conductive layers nested between dielectric layers, creating a compact nested arrangement that maximizes the use of available space and increases capacitance density without proportionally increasing device volume
2Volume of moving object
If the device size is reduced for miniaturization, then the integration level increases, but the capacitance value decreases due to limited surface area
Solution Approach 1:
The multi-wing structure utilizes vertical stacking and three-dimensional configuration to increase the effective surface area for capacitance formation. By extending the structure in the vertical dimension with multiple stacked layers rather than expanding horizontally, the patent achieves high capacitance values while maintaining reduced device footprint and size
Solution Approach 2:
The capacitor is segmented into multiple discrete conductive layers and dielectric layers arranged in a laminated configuration. This segmentation allows the total capacitance to be distributed across multiple smaller capacitive elements stacked together, increasing the effective surface area for charge storage without increasing the overall device volume, thereby achieving high capacitance in a miniaturized form factor
Data Source
AI summary
A capacitor includes at least one multi-wing structure; a laminated structure, where the laminated structure clads the at least one multi-wing structure and includes at least one dielectric layer and a plurality of conductive layers, and the at least one dielectric layer and the plurality of conductive layers form a structure that a conductive layer and a dielectric layer are adjacent to each other; at least one first external electrode, where the first external electrode is electrically connected to some conductive layer(s) in the plurality of conductive layers; at least one second external electrode, wherein the second external electrode is electrically connected to the other conductive layer(s) in the plurality of conductive layers, and a conductive layer in the laminated structure adjacent to each conductive layer in the some conductive layer(s) includes at least one conductive layer in the other conductive layer(s).