Multi-Zone Fluid Spray Cooling for Semiconductor Device Under Test
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor testing apparatuses lack efficient multi-zone temperature control and cooling systems, particularly for integrated circuits with varying power density areas, leading to inadequate thermal management and increased equipment size and power requirements.
Innovation Solution
A multi-zone temperature control system using independently controllable fluid nozzles arranged in an array to project fluid spray fields onto specific zones of a device under test, with a test controller adjusting fluid flow and temperature based on zone-specific feedback to maintain target temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-zone temperature control system is used, then the system structure is simple, but it cannot provide local temperature control for different zones of the DUT
Solution Approach 1:
The cooling system is divided into multiple independently controllable nozzles arranged in an array, with each nozzle serving a specific zone of the DUT. This segmentation allows different zones to be controlled at different temperatures simultaneously, providing local temperature control while maintaining relatively simple individual nozzle structures.
Solution Approach 2:
Each nozzle is configured to provide cooling to a specific zone of the DUT, allowing different zones to have different cooling rates and temperatures according to their specific thermal requirements. This local quality approach enables precise thermal management for high-power-density areas while reducing cooling for lower-power areas.
2Volume of stationary object
If conventional cooling systems are used, then the equipment size is large, but the cooling efficiency is insufficient and thermal spikes occur
Solution Approach 1:
The system replaces conventional mechanical cooling systems with a fluid spray-based thermal management system. Fluid nozzles deliver cooled fluid directly to the DUT zones, enabling more efficient heat removal with smaller equipment footprint and faster response to thermal spikes.
Solution Approach 2:
The cooling system utilizes phase transition of the cooling fluid (evaporation) to enhance cooling efficiency. By controlling the fluid to evaporate on the DUT surface, the system achieves high cooling efficiency and rapid response to thermal spikes while maintaining a compact form factor.
3Device complexity
If uniform cooling is applied to the entire DUT, then the cooling system is simple, but it cannot address varying power density areas effectively
Solution Approach 1:
The DUT surface is divided into multiple zones, each served by its own nozzle. This segmentation allows precise temperature control for each zone according to its power density characteristics, achieving high temperature control precision while keeping individual nozzle designs simple.
Solution Approach 2:
Each zone receives customized cooling based on its specific thermal requirements. High-power-density areas receive intensified cooling while low-power areas receive reduced cooling, achieving precise temperature control across the entire DUT surface without requiring complex overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management efficiency by allowing precise temperature control across different zones, reducing thermal spikes and equipment size, and improving cooling performance through vapor quality optimization.
Implementation Method 1
A higher ratio is typically desired since this implies that more of the cooling fluid has been vaporized, removing more heat than if liquid fluid was simply heated without changing phase.
Data Source
AI summary
Provided is a fluid delivery system with a plurality of nozzles to control the temperatures of multiple zones in a device under test.