Multi-Zone Heat Transfer Structure for Substrate Temperature Switching
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Solution Overview
Problem
Existing substrate processing devices face challenges in efficiently adjusting and maintaining substrate temperatures across a wide range, including high, low, and cryogenic temperatures, leading to issues like condensation and particle adsorption during temperature changes, and difficulty in rapidly changing coolant temperatures.
Innovation Solution
A multi-zone heat transfer adjustment structure is introduced between the substrate and the base structure, utilizing a heat transfer gas with pressure control to manage heat transfer, allowing for precise temperature adjustment during and after processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coolant channel is supplied to the base structure to control substrate temperature, then temperature control capability is improved, but the response time for temperature changes is slow and the temperature range is limited
Solution Approach 1:
The invention divides the heat transfer control into multiple independent zones: a first heat transfer zone between the substrate and electrostatic chuck, and a second heat transfer zone between the electrostatic chuck and base structure. Each zone has independent heat transfer adjustment capability, allowing selective and rapid temperature control without waiting for coolant temperature changes.
Solution Approach 2:
The invention introduces a heat transfer gas as an intermediary medium in the first heat transfer zone. By controlling the pressure of this gas, heat transfer between the substrate and electrostatic chuck can be rapidly adjusted. The gas acts as a controllable thermal conductor that responds quickly to pressure changes, bypassing the slow thermal inertia of coolant systems.
2Temperature
If the substrate temperature is changed from low temperature to extremely low temperature or vice versa, then temperature range is improved, but the temperature change time is extended
Solution Approach 1:
The invention makes the heat transfer characteristics dynamic by introducing a controllable heat transfer gas whose pressure can be adjusted in real-time. This allows the system to adapt heat transfer rates dynamically during temperature transitions, enabling rapid switching between temperature ranges without being constrained by fixed thermal pathways or slow coolant response.
3Adaptability or versatility
If the substrate is transported outside the chamber at low or cryogenic temperature, then process flexibility is improved, but condensation and particle adsorption occur due to water vapor
Solution Approach 1:
The invention applies preliminary heating or insulation measures before substrate transport. The heat transfer adjustment structure can pre-warm the substrate or create a thermal barrier, reducing the temperature differential between the substrate and ambient environment. This preliminary action prevents condensation and particle adsorption from occurring during transport.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat blocking or transfer between the substrate and electrostatic chuck, facilitating rapid and precise temperature control across various ranges, reducing issues like condensation and particle adsorption, and improving processing efficiency.
Implementation Method 1
utilizing a heat transfer gas with pressure control to manage heat transfer
Implementation Method 2
heat transfer adjustment structure which is located between the substrate holder and the base structure
Implementation Method 3
an electrostatic chuck which fixes a substrate using electrostatic force
Implementation Method 4
a coolant channel located below the electrostatic chuck to prevent the rising of temperature due to an energy, such as plasma, light, or heater and adjusts a temperature by supplying a coolant
Data Source
AI summary
Exemplary embodiments of the present invention provide a substrate processing device and a multi-zone temperature control method which block or transfer heat generated between a substrate and an electrostatic chuck and a base structure or between specific structures using the change in pressure of a heat transfer gas by installing a multi-zone heat transfer adjustment structure between a base structure in which a coolant is supplied and the substrate to easily adjust the temperature of the substrate during the process or after the process.