Multi-zone heater RF loss reduction

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Solution Overview

Problem

Current substrate support systems in semiconductor manufacturing face challenges in achieving uniform temperature distribution and film deposition across substrates, leading to radial and azimuthal non-uniformity, which affects the quality of semiconductor devices.

Innovation Solution

The implementation of substrate support assemblies with multiple independently controllable heater zones, including an upper heater with concentric circular and annular zones and a lower heater with arcuate zones, along with an RF mesh, to provide precise temperature control and minimize RF coupling loss and DC leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single heating device is used in the substrate support, then the structure is simple, but uniform temperature distribution across the substrate cannot be achieved

Engineering Contradiction:

Improvetemperature uniformityVSAvoidheater structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The heating device is divided into multiple independent heater zones (first heater zone, second heater zone, third heater zone, fourth heater zone) with different heating patterns. The first and second heater zones provide radial temperature control, while the third and fourth heater zones provide azimuthal temperature control, enabling uniform temperature distribution across the substrate surface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heater zone is designed with specific heating characteristics tailored to local requirements. The first heater zone heats a first portion of the substrate, the second heater zone heats a second portion, and the third and fourth heater zones provide azimuthal heating. This localized heating approach allows precise temperature control in different regions of the substrate.

Inventive Principle:

Principle #3Local quality

2Adaptability or versatility

If the substrate support is used for both heat generation and plasma generation, then the device is multi-functional, but interference effects occur

Engineering Contradiction:

Improvemulti-functionalityVSAvoidprocess stability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The substrate support structure is segmented into distinct functional zones: heating elements for thermal processing, electrostatic chuck electrodes for substrate clamping, and RF mesh for plasma generation. This segmentation allows each function to operate independently without interference, enabling reliable simultaneous multi-functional operation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

An RF mesh is introduced as an intermediary component between the heating elements and the plasma generation system. The RF mesh enables plasma generation while isolating the heating elements from direct plasma exposure, preventing interference effects and allowing both heating and plasma functions to operate reliably.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Loss of energy

If heater power rods are placed close together in the support stem, then the structure is compact, but RF coupling loss increases

Engineering Contradiction:

ImproveRF coupling lossVSAvoidrod spacing arrangement

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The heater power rods are arranged and spaced to maintain equipotential conditions that minimize RF coupling losses. By optimizing the spacing and positioning of the rods within the support stem, the design reduces electromagnetic interference and energy loss while maintaining structural compactness.

Inventive Principle:

Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances film uniformity by addressing temperature non-uniformity issues and reducing RF coupling losses, resulting in improved deposition quality across the substrate surface.

Implementation Method 1

Internally located heating devices may generate heat within the support, and the heat may be transferred conductively to the substrate

Methodology Applied

Scientific EffectResistive heating: Joule Heating

Implementation Method 2

the substrate support may also be utilized in some technologies to chuck the substrate to the support electrostatically

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 3

Plasma generated near the substrate may cause bombardment of components

Methodology Applied

Scientific EffectPlasma generation: Plasma

Implementation Method 4

the heat may be transferred conductively to the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230011261A1Multi-zone heater with minimum RF loss

Publication Date: 2023.01.12 APPLIED MATERIALS INC

AI summary

Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The substrate support assemblies may include a support stem coupled with the electrostatic chuck body. The substrate support assemblies may include an upper heater embedded within the electrostatic chuck body. The upper heater may include a center heater zone and one or more annular heater zones that are concentric with the center heating zone. The substrate support assemblies may include a lower heater embedded within the electrostatic chuck body at a position below the upper heater. The lower heater may include a plurality of arcuate heater zones.