Multi-Zone Plenum Cooling for Plasma-Heated Dielectric Windows
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Solution Overview
Problem
High-energy ion flux in substrate processing systems causes uneven heating of ceramic/dielectric windows, leading to temperature differentials and a risk of window cracking, which existing air circulation apparatuses fail to adequately address.
Innovation Solution
A multi-zone cooling apparatus with plenums and air amplifiers, including central and edge air inlets and conduits, is used to provide comprehensive air flow coverage across the window, allowing for separate control of air flow rates to address center, middle, and edge hot conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air circulation apparatus is used to cool the window, then some portions of the window are cooled, but other portions experience insufficient cooling leading to hotspots and temperature differentials
Solution Approach 1:
The cooling apparatus is divided into multiple independent air circulation zones (first zone, second zone, third zone) that can be controlled separately. Each zone targets specific portions of the window (center, middle, edge) to provide localized cooling where needed, preventing hotspots and temperature differentials that lead to cracking.
Solution Approach 2:
Different regions of the window receive customized cooling based on their specific thermal conditions. The first air circulation apparatus targets the center portion, the second targets the middle portion, and the third targets the edge portion. This localized approach ensures each area is cooled according to its specific heating pattern, maintaining overall temperature uniformity.
2Productivity
If high power TCP is used for substrate processing, then processing efficiency increases, but window heating and temperature differentials worsen
Solution Approach 1:
The cooling system is segmented into three independently controllable air circulation zones that can be activated based on the specific processing conditions. During high power TCP processes, all zones can be activated to provide comprehensive cooling coverage, preventing temperature differentials while maintaining high processing efficiency.
Solution Approach 2:
The cooling apparatus provides dynamic, adaptable cooling by allowing independent control of each air circulation zone. This enables the system to respond to varying thermal conditions during different substrate processing operations, maintaining temperature uniformity even during high power processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature hotspots and minimizes the risk of window cracking by ensuring even cooling across the dielectric window, enhancing the reliability of substrate processing systems.
Implementation Method 1
Air circulation apparatus helps to cool down portions of a window
Implementation Method 2
one or more air amplifiers and accompanying conduits provide air to the one or more plenums to provide air flow to the window
Data Source
AI summary
A plenum, positioned beneath a first coil and above a window disposed on a top portion of a processing chamber, has side walls and a top surface covering an upper surface of the window and has a first air inlet positioned at a center portion to receive airflow from a first air amplifier. The first air inlet includes holes to distribute the air across the window within the side walls to reduce hotspots at a center portion of the window. The plenum includes a second air inlet at an edge portion of the top surface to receive the airflow from a second air amplifier to reduce hotspots at an edge portion of the window, and a third air inlet between the center and edge portions of the top surface to receive the airflow from a third air amplifier to reduce hotspots at a middle portion of the window.