Multi-Zone Substrate Support Assembly for Wafer Temperature Uniformity
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Solution Overview
Problem
Semiconductor manufacturing processes face challenges in maintaining uniform substrate temperatures, leading to inconsistencies in deposited films and etched structures, which can result in device failure due to temperature fluctuations and material deposition on equipment and substrates.
Innovation Solution
The use of substrate support assemblies with a top puck, backing plate, cooling plate, and heater configurations that allow for independent temperature control across multiple zones, including thermal breaks and channels for fluid distribution, to maintain temperature uniformity within +/-0.5°C across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a substrate support assembly is used to control substrate temperature, then temperature control is improved, but temperature uniformity across the substrate deteriorates due to temperature zones and regions
Solution Approach 1:
The substrate support assembly is divided into multiple heating zones with independent temperature control. The heater is segmented into first and second heating zones that can be controlled separately, allowing different temperature profiles across the substrate surface to eliminate temperature uniformity issues
Solution Approach 2:
Different regions of the substrate support assembly are equipped with different heating capabilities. The first heating zone targets the central region while the second heating zone targets the peripheral region, providing locally optimized temperature control to achieve overall uniformity
2Productivity
If material deposition processes are performed in the chamber, then semiconductor devices are manufactured, but material deposits on equipment and substrates causing alignment issues and re-deposition
Solution Approach 1:
The edge ring is designed to be removable from the substrate support assembly. After deposition processes, the edge ring can be taken out and cleaned separately, preventing material accumulation that would otherwise cause alignment issues and re-deposition problems during subsequent processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides improved heating and cooling performance, ensuring uniformity and reducing particle deposition, thereby enhancing the quality and consistency of semiconductor processing operations.
Implementation Method 1
The cooling plate may define a channel configured to distribute a temperature controlled fluid through the cooling plate
Implementation Method 2
The plurality of heaters may include resistive heaters extending across a back surface of the top puck
Implementation Method 3
The top puck may define a thermal break between an interior zone and an exterior zone of the top puck
Data Source
AI summary
Exemplary support assemblies may include a top puck and a backing plate coupled with the top puck. The support assemblies may include a cooling plate coupled with the backing plate. The support assemblies may include a heater coupled between the cooling plate and the backing plate. The support assemblies may also include a back plate coupled with the backing plate about an exterior of the backing plate. The back plate may at least partially define a volume, and the heater and the cooling plate may be housed within the volume.