Multi-Zone Thermal Interposer Control for Faster IC Testing
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Solution Overview
Problem
Conventional thermal control systems for integrated circuit testing are limited in their ability to rapidly and accurately control temperature across different zones of a device under test, due to environmental limitations and complex, expensive mechanisms required for testing, which restricts the rate and efficiency of testing processes.
Innovation Solution
A system comprising a thermal management head with an active thermal interposer device that can be selectively heated and cooled, allowing for independent temperature control of multiple zones of an unpackaged integrated circuit device under test, using a test processor to manage thermal processes based on various inputs including cold plate temperature, junction temperature, and power supplied during testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional environmental chambers are used for thermal control during device testing, then the device can be subjected to environmental stress testing, but the testing rate is limited due to large thermal mass and slow temperature change response
Solution Approach 1:
The patent divides the device under test into multiple independently controllable thermal zones using discrete thermal control elements positioned at different locations. Each zone can be controlled to different temperatures simultaneously, enabling parallel thermal testing scenarios and dramatically increasing testing throughput without requiring large environmental chambers.
Solution Approach 2:
The patent introduces discrete thermal control elements as intermediaries between the device and the testing environment. These elements provide direct thermal control to specific device regions, eliminating the need for large environmental chambers that slowly change temperature. The intermediaries enable rapid temperature changes and precise thermal management.
2Adaptability or versatility
If environmental chambers with large volumes and mass are used, then comprehensive environmental testing can be performed, but the complexity and cost of insertion and removal mechanisms increase
Solution Approach 1:
The patent extracts the thermal control function from the bulky environmental chamber and implements it directly at the device level using discrete thermal control elements. This eliminates the need for complex insertion and removal mechanisms while maintaining the ability to perform comprehensive environmental testing through software-controlled thermal scenarios.
Solution Approach 2:
The discrete thermal control elements can be reconfigured through software to create different thermal scenarios and testing conditions. The same hardware platform can test multiple device types and thermal conditions without requiring physical reconfiguration or complex mechanical mechanisms, providing universal testing capability.
3Adaptability or versatility
If conventional single-zone thermal control is used, then the system is simpler, but the ability to control different portions of the device to different temperatures is limited
Solution Approach 1:
The patent segments the thermal control system into multiple discrete independently controllable zones, each with its own thermal control element. This segmentation enables different portions of the device to be controlled to different temperatures simultaneously, creating multi-zone thermal scenarios while keeping each individual control element relatively simple.
Solution Approach 2:
The patent implements dynamically reconfigurable thermal control where the thermal zones and their parameters can be changed through software without physical reconfiguration. This dynamic capability allows the system to adapt to different testing scenarios and device types, providing high versatility with moderate hardware complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and precise thermal management of integrated circuit devices, allowing for concurrent testing of multiple zones at different temperatures, enhancing testing efficiency and compatibility with existing systems while reducing the complexity and cost of testing mechanisms.
Implementation Method 1
disposal a cold plate of the thermal management head; controlling cooling to the cold plate
Implementation Method 2
an active thermal interposer device that can be selectively heated and cooled, allowing for independent temperature control of multiple zones
Data Source
AI summary
Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a die and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.