3D Multiaperture Imaging Device with Offset Optical Channels
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Solution Overview
Problem
Conventional 3D multi-aperture imaging devices face challenges in miniaturization and efficient processing of captured images, particularly in mobile devices, where they struggle to capture an entire field of view with high functional bandwidth and adapt to different device structures.
Innovation Solution
The solution involves a 3D multi-aperture imaging device with a processor that combines image information from multiple pixels with meta-information to generate an output signal, including a data header with structural information, allowing for flexible image processing across various device structures and enabling miniaturization without requiring complete knowledge of the device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple optical channels are used to capture different partial fields of view, then the field of view coverage is improved, but the device size increases
Solution Approach 1:
The patent combines multiple optical channels with their respective image sensors into a single integrated imaging device structure. The optical channels are arranged in a compact configuration where they share common structural elements and are laterally offset by a base distance, allowing simultaneous capture of multiple partial fields of view within a minimized overall device volume.
Solution Approach 2:
The patent arranges optical channels in a lateral offset configuration along a base distance direction, transitioning from a single-plane arrangement to a multi-dimensional spatial configuration. This allows the optical channels to capture overlapping partial fields of view in different spatial directions while maintaining a compact footprint.
2Adaptability or versatility
If device structure information is embedded in output signal, then image processing adaptability is improved, but data transmission complexity increases
Solution Approach 1:
The patent embeds device structure information (metadata) about the multi-aperture imaging device into the output signal header before image transmission. This preliminary inclusion of structural parameters (such as optical channel arrangement, base distance, and field of view overlap characteristics) enables receiving devices to properly interpret and process the image data without requiring complex real-time queries about the imaging device configuration.
Data Source
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AI summary
A 3D multi-aperture imaging device described herein comprises an image sensor (12) having a plurality of image sensor areas, each image sensor area comprising a plurality of pixels. The 3D multi-aperture imaging device comprises a first plurality (141) of optical channels (1611, 1612, 1613, 1614) for imaging overlapping first partial fields of view (3011, 3012, 3013, 3014) of a total field of view (28) onto first image sensor areas (1211, 1212, 1213, 1214) of the image sensor and comprises a second plurality (142) of optical channels (1621, 1622, 1623, 1624) for imaging mutually and with the first partial fields of view second partial fields of view (3021, 3022, 3023, 3024) of the total field of view (28) onto second image sensor areas (1221, 1222, 1223, 1224) of the image sensor. The first and second plurality of optical channels are arranged laterally offset from each other by a base distance (BA).The 3D multi-aperture imaging device comprises a processor configured to receive image sensor data from the image sensor, which contains information about the first and second partial fields of view mapped onto the first and second plurality of image sensor areas, and which is configured to provide an output signal comprising a data header and payload data, wherein the data header contains information relating to the structure of the 3D multi-aperture imaging device and wherein the payload data comprises image information obtained from the pixels of the first image sensor areas and the second image sensor areas.