Multi-Band Antenna Layout Using a Low-k Cavity Layer
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Solution Overview
Problem
The development of multi-band antennas for 5G communication is complicated by the need for multiple dielectric layers and vias, leading to complex manufacturing processes and high costs, especially when trying to integrate low-band and high-band antennas in a vertical or horizontal configuration.
Innovation Solution
A multi-band antenna device is designed with a configuration that includes a first dielectric layer, a second dielectric layer with a lower dielectric constant, and a third dielectric layer with a higher dielectric constant, where the second dielectric layer has a cavity overlapping the antenna patches, allowing for the integration of multiple bandwidths without a complex vertical structure, using the same dielectric layer for both low-band and high-band antennas positioned horizontally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multi-band antennas are stacked and formed in the height direction, then multiple frequency bands can be supported, but the vertical structure becomes complicated and manufacturing cost increases
Solution Approach 1:
The patent transitions from vertical stacking to horizontal arrangement of antenna elements. Multiple antenna patches are disposed side-by-side in the horizontal plane rather than stacking them vertically, thereby supporting multiple frequency bands while maintaining a simpler structure that avoids complex via formations through multiple dielectric layers.
Solution Approach 2:
The antenna device is divided into multiple independent antenna patches (first antenna patch, second antenna patch, third antenna patch, fourth antenna patch) that can be individually designed for different frequency bands. These segmented patches are arranged horizontally and share common ground structures, allowing multi-band operation without requiring complex vertical integration.
2Adaptability or versatility
If multiple dielectric layers and vias are formed to integrate low-band and high-band antennas, then multi-band functionality is achieved, but the manufacturing process becomes complicated and costs increase
Solution Approach 1:
The patent merges the low-band antenna and high-band antenna into a single integrated structure where multiple antenna patches share common ground planes and dielectric layers. This consolidation reduces the number of separate manufacturing processes required compared to forming distinct stacked antenna structures, thereby simplifying production while maintaining multi-band functionality.
Solution Approach 2:
The common ground structure serves multiple functions: it acts as the ground plane for both low-band and high-band antennas, provides mechanical support for all antenna patches, and enables electromagnetic coupling between different frequency band elements. This multi-functional design reduces the overall component count and manufacturing steps.
3Adaptability or versatility
If low-band antenna and high-band antenna are divided and arranged horizontally through different manufacturing processes, then multi-band support is achieved, but manufacturing complexity and costs remain high
Solution Approach 1:
Instead of using different manufacturing processes for low-band and high-band antennas as in conventional approaches, the patent inverts the approach by using a unified manufacturing process to create all antenna patches. All patches are formed simultaneously through the same dielectric layer deposition and patterning steps, thereby achieving multi-band support with simplified and integrated manufacturing.
4Volume of moving object
If vertical stacking is used to integrate antennas, then space utilization is improved, but structural complexity and manufacturing difficulty increase
Solution Approach 1:
The patent redistributes antenna elements from the vertical dimension to the horizontal dimension. Multiple antenna patches are arranged in the planar area rather than stacking them in the height direction, thereby achieving efficient space utilization while avoiding the structural complexity and manufacturing difficulty associated with vertical integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the manufacturing process and reduces costs by allowing the integration of multiple bandwidths in a horizontal configuration, increasing the gain and directivity of the antennas while maintaining efficient RF signal transmission and reception across different frequency bands.
Implementation Method 1
the dielectric constant of the second dielectric layer is lower than the dielectric constant of the first dielectric layer and the dielectric constant of the third dielectric layer
Implementation Method 2
the second dielectric layer has a cavity overlapping the second antenna patch
Data Source
AI summary
An antenna device according to embodiment includes: a first dielectric layer; a second dielectric layer disposed on the first dielectric layer; a third dielectric layer disposed on the second dielectric layer; a first antenna including a first feed via passing through the first dielectric layer and a first antenna patch disposed in a first surface of the first dielectric layer; and a second antenna including a second feed via passing through the first dielectric layer and a second antenna patch disposed in the first surface of the first dielectric layer, wherein a dielectric constant of the second dielectric layer is lower than a dielectric constant of the first dielectric layer and a dielectric constant of the third dielectric layer, and the second dielectric layer has a cavity overlapping the second antenna patch.