Multi-Band Antenna Feed Structure for Metal Frame Transition
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Solution Overview
Problem
Current antenna structures in electronic devices face challenges in transitioning and feeding multiple frequency bands due to the influence of metal frames and existing transmission line modes, particularly in high-frequency bands like 5G communication, where quarter wave shorting stubs and opened waveguides are limited in their ability to handle diverse frequency ranges.
Innovation Solution
The proposed antenna structure includes a housing with a conductive side member and a printed circuit board featuring conductive layers, vias, and a wireless communication circuit that uses a feeding line and conductive patterns to transition signals across multiple frequency bands, including 3 GHz to 100 GHz, through a combination of conductive vias and side vias to create open circuit structures for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a quarter wave shorting stub is used to transition transmission mode, then transition in a specific band is achieved, but it cannot transition a plurality of frequency bands
Solution Approach 1:
The patent combines multiple quarter wave shorting stubs with different electrical lengths into a single transmission line structure. Each stub is designed to resonate at different frequency bands, and their combined effect enables multi-band transition capability while maintaining a unified structural implementation.
Solution Approach 2:
The transmission line structure is designed to perform multiple functions: it serves as both the main signal transmission path and incorporates integrated shorting stubs that provide mode transition capabilities across multiple frequency bands, eliminating the need for separate transition structures for each band.
2Adaptability or versatility
If an opened waveguide is used to transition transmission mode, then mode transition is achieved, but it is difficult to implement an opened circuit in a high-frequency band when metal frame is disposed
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary between the opened waveguide structure and the metal frame. This dielectric layer acts as a mediator that allows the opened circuit structure to function properly at high frequencies by providing electrical isolation and preventing unwanted coupling with the metal frame, thereby enabling reliable mode transition in high-frequency bands.
3Reliability
If a metal frame is disposed around the antenna, then radiation patterns are prevented from being distorted, but it influences signal transmission in high-frequency bands
Solution Approach 1:
The patent applies different material properties to different regions: the metal frame is used in regions where mechanical support and radiation pattern stability are needed, while dielectric materials are strategically placed in regions where high-frequency signal transmission paths exist. This localized differentiation allows the metal frame to provide structural benefits without degrading high-frequency signal transmission through the transmission line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective signal feeding to a metal frame antenna radiator, enhancing radiation efficiency across various frequency bands by preventing signal propagation into the printed circuit board and improving radiation performance in both low and high-frequency bands.
Implementation Method 1
a conductive via connecting the feeding line and the first conductive layer
Implementation Method 2
a conductive pattern interposed between the feeding line and the first conductive layer and capacitively coupled with the first conductive layer
Implementation Method 3
a plurality of first side vias electrically connecting the first conductive layer and the third conductive layer and a plurality of second side vias electrically connecting the third conductive layer and the fourth conductive layer
Implementation Method 4
a wireless communication circuit that is electrically connected with the feeding line and transmits and/or receives signals each having a frequency between 3 GHz and 100 GHz
Data Source
AI summary
Disclosed is an electronic device comprising: a housing comprising a first plate, a second plate, and a side member, the side member having a first part comprising a first surface, a second surface, a through-hole formed from the first surface to the second surface in a first direction in which same penetrates the side member, and a nonconductive material; a display; a printed circuit board comprising a third surface, a fourth surface, a first conductive layer, a second conductive layer, a feeding line, a conductive pattern, a conductive via, a third conductive layer disposed between the first conductive layer and the second conductive layer, a fourth conductive layer disposed between the first conductive layer and the third conductive layer, multiple first side vias formed so as to electrically connect the first conductive layer and the third conductive layer and to be spaced apart from the conductive via by a first distance in a second direction, which is perpendicular to the first direction, and in which same face away from the through-hole and the slit, and multiple second side vias formed so as to electrically connect the third conductive layer and the fourth conductive layer and to be spaced apart from the conductive via by a second distance, which is different from the first distance, in the second direction; and at least one wireless communication circuit. Various other embodiments recognizable from the specification are also possible.