Multiband Antenna Switching via TSV Electrical Length Adjustment
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Solution Overview
Problem
Current multiband antenna structures are limited in supporting both legacy and millimeter wave frequency bands, requiring separate antennas for single band communication, which is inefficient and lacks flexibility for future communication systems that need to handle multiple frequency bands.
Innovation Solution
An on-chip multiband integrated antenna is developed using an antenna switch that selectively connects to either of two conductive patterns based on the frequency band, allowing the same antenna to operate in multiple bands by adjusting its electrical length through a through silicon via (TSV) connection, enabling seamless switching between different frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single integrated antenna is used to support multiple frequency bands, then device complexity is reduced, but the ability to support both legacy and millimeter wave bands simultaneously is limited
Solution Approach 1:
The patent implements a reconfigurable antenna structure where the electrical length of the conductive pattern can be dynamically adjusted through TSV connections to different ground planes. This allows the same physical antenna structure to adapt its electrical characteristics to support different frequency bands (legacy and millimeter wave) effectively, resolving the contradiction between using a single antenna and supporting multiple bands.
Solution Approach 2:
The patent changes the electrical parameters of the antenna by selectively connecting different portions of the conductive pattern to ground planes through TSVs. By adjusting which TSVs are connected and to which ground planes, the electrical length and impedance of the antenna can be modified to optimize performance across different frequency bands, enabling a single antenna to serve multiple purposes.
2Adaptability or versatility
If multiple separate antennas are used for different frequency bands, then frequency band support is improved, but device complexity and power consumption increase
Solution Approach 1:
The patent creates a universal antenna structure that can function across multiple frequency bands by incorporating a reconfigurable conductive pattern with selective TSV connections. Instead of requiring separate dedicated antennas for legacy and millimeter wave bands, this single multi-functional antenna structure can be configured to operate in either band, reducing the total number of antennas needed while maintaining full frequency band support capability.
3Adaptability or versatility
If multiple separate antennas are used for different frequency bands, then frequency band support is improved, but power consumption and signal redundancy increase
Solution Approach 1:
The reconfigurable antenna structure eliminates the need for multiple separate antenna systems, thereby reducing the total power consumption associated with operating multiple independent antenna circuits. The single multi-functional antenna consumes less power while providing the same frequency band support capabilities, as it shares common feed networks and control circuits across different operating modes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a single antenna to support multiple frequency bands, enhancing communication efficiency and flexibility, particularly in 5G and mmWave frequency ranges, by minimizing the need for multiple antennas and reducing signal redundancy and power consumption.
Implementation Method 1
a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure
Implementation Method 2
disposing an on-chip group plane for the purpose of emitting and reflecting an electromagnetic field
Data Source
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AI summary
An electronic device and an antenna device of an electronic device are provided. The electronic device includes a wafer, a radio frequency integrated circuit (RFIC) fabricated in the wafer, an antenna interposer disposed on a surface of the wafer, an antenna structure fabricated in the antenna interposer, the antenna structure comprising a first conductive pattern with a first electrical length and a second conductive pattern with a second electrical length, a switch formed in the RFIC and electrically connected to at least one of the first conductive pattern or the second conductive pattern based on a frequency band of a signal being transmitted or received by the RFIC, and a through hole formed in at least part of the wafer or the antenna interposer and electrically connecting the RFIC and the antenna structure.