Multi-Band Acoustic Filter Package With Shared Ground Layout
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Solution Overview
Problem
Existing acoustic wave filters face challenges in reducing their size while maintaining performance, particularly due to the need for separate ground connections and additional wiring for multiple filters, which increases die size.
Innovation Solution
The implementation of a shared ground connection between shunt resonators of multiple acoustic wave filters, allowing them to be coupled to a common ground pad through an electrically conductive path, thereby reducing the need for separate ground pads and minimizing die size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate ground connections are used for multiple acoustic wave filters, then each filter can be independently connected to ground, but the overall die size increases due to additional ground pads and wiring
Solution Approach 1:
The patent combines multiple separate ground connections into a single shared ground connection. The first and second acoustic wave filters are both connected to the same ground node, eliminating the need for separate ground pads and interconnect structures. This merging approach reduces the overall die area while maintaining proper grounding for both filters.
Solution Approach 2:
The shared ground node serves multiple functions simultaneously - it provides the ground reference for both the first and second acoustic wave filters. This universal ground connection replaces what would traditionally require multiple dedicated ground points, achieving space efficiency without compromising the grounding requirements of individual filters.
2Reliability
If multiple separate ground pads are used for multiple filters, then each filter has its own ground reference, but the wiring complexity and device complexity increase
Solution Approach 1:
The patent merges multiple ground reference requirements into a single shared ground node. Instead of implementing separate ground pads and complex interconnect wiring for each filter, both acoustic wave filters connect to the same ground node, significantly simplifying the wiring architecture while maintaining stable ground references.
3Area of stationary object
If the distance between shunt resonators is minimized, then the area is reduced, but electrical characteristic mismatches may occur that degrade filter performance
Solution Approach 1:
By merging the ground connections of multiple filters into a single shared node, the patent eliminates the need for separate ground pads and their associated interconnect structures. This approach minimizes the area occupied by ground infrastructure while the shared ground node itself provides a common reference point that reduces electrical characteristic mismatches between filters.
Data Source
AI summary
A multi band filter package is disclosed. The multi band filter can include a first acoustic wave filter that is mounted on a carrier, a second acoustic wave filter mounted on the carrier, and a ground pad on the carrier. The first acoustic wave filter has a first filter component and a first shunt resonator. The second acoustic wave filter has a second filter component and a second shunt resonator. The first and second acoustic wave filters are arranged such that the first and second shunt resonators are positioned between the first and second filter component. The first and second shunt resonators are coupled to the ground pad by way of an electrically conductive path. A least a portion of the electrically conductive path is positioned between the first and second shunt resonators.