Multiband PA Module Chip Partitioning to Limit RF Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power amplification modules for multiband and multimode compliant front-end circuits are large in size and suffer from signal quality deterioration due to mutual interference of high-frequency signals when amplification elements are formed on the same chip.
Innovation Solution
A power amplification module configuration where the previous stage amplification element and filter band selection portion are formed on one chip, while the posterior stage amplification element is on a separate chip, with switch elements and filter elements strategically arranged to minimize interference and reduce size by optimizing chip configuration and wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all amplification elements and filter components are configured as separate chips, then signal quality is maintained, but the device size increases
Solution Approach 1:
The patent combines the previous stage amplification element and the filter band selection portion into a single first chip, while keeping the posterior stage amplification element on a separate second chip. This partial integration reduces the number of discrete components and connection interfaces, thereby reducing overall device size while maintaining signal quality through selective integration of components that benefit from close coupling.
Solution Approach 2:
The patent segments the power amplification module into two functional groups: the first chip containing the previous stage amplification element and filter band selection portion, and the second chip containing the posterior stage amplification element. This segmentation allows optimization of each chip's function while reducing mutual interference between high-frequency signals by physically separating sensitive components.
2Area of stationary object
If all amplification elements are formed on the same chip, then device size is reduced, but mutual interference of high-frequency signals deteriorates signal quality
Solution Approach 1:
The patent divides the amplification function across two separate chips: the first chip handles the previous stage amplification and filter band selection, while the second chip handles the posterior stage amplification. This segmentation physically separates the high-frequency signal paths, reducing mutual interference and maintaining signal quality while achieving size reduction through integrated design within each chip.
3Adaptability or versatility
If multiple switch circuits and filter components are provided separately, then frequency band switching capability is improved, but device complexity increases
Solution Approach 1:
The patent integrates the filter band selection portion with the previous stage amplification element on the first chip. The filter band selection portion includes switch circuits and filter elements that are combined into a unified structure, reducing the number of separate components while maintaining the ability to switch between different frequency bands through coordinated control of the integrated elements.
Data Source
AI summary
A PA module (10A) includes a previous stage amplification element (12) to amplify a high-frequency signal, a posterior stage amplification element (13) to amplify the high-frequency signal amplified by the previous stage amplification element (12), and a variable filter circuit arranged between the previous stage amplification element (12) and the posterior stage amplification element (13) to vary a pass band and an attenuation band in accordance with a frequency band of the high-frequency signal, in which the variable filter circuit includes a filter portion (16) and switches (14 and 15) to vary the pass band and the attenuation band of the variable filter circuit, and the previous stage amplification element (12) and at least a part of the switches (14 and 15) are formed in one chip using a chip A, the posterior stage amplification element (13) are included in a second chip which is different from the chip A.