Stacked RF Module Layout for Multiband Size and Heat Constraints
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Solution Overview
Problem
The increasing use of multiband technology in mobile communication devices has led to an increase in the number of circuit components, making it difficult to further reduce the size of radio frequency modules.
Innovation Solution
A radio frequency module design that includes a module substrate with two major surfaces, a first base part made of a first semiconductor material containing a PA control circuit and a second base part made of a different semiconductor material containing a power amplifier, with the second base part disposed between the module substrate and the first base part, connected via an electrode, and switches distributed on different major surfaces to optimize component placement and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of circuit components is increased to support multiband technology, then the communication functionality is improved, but the module size increases
Solution Approach 1:
The patent implements stacking of multiple circuits (power amplifier circuit, switch circuit, and other circuits) in the vertical direction, where circuits are arranged in layers one above another. This nesting approach allows multiple functional circuits to coexist in a compact volume, supporting multiband functionality while minimizing the horizontal footprint of the module.
Solution Approach 2:
The patent transitions from planar arrangement of circuits to three-dimensional stacking configuration. By utilizing the vertical dimension for circuit placement and connecting them through conductors extending in the thickness direction, the design accommodates multiple bands and functions without increasing the module's planar area.
2Area of stationary object
If circuits are stacked to reduce module size, then the area is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a heat dissipation structure as an intermediary component positioned between the power amplifier circuit (which generates heat) and the substrate. This heat dissipation structure acts as a thermal mediator, conducting heat away from the power amplifier while electrically isolating it through an insulating layer, thus managing thermal issues in the compact stacked configuration.
3Reliability
If different semiconductor materials are used for different base parts, then the performance for specific bands is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent applies different semiconductor materials to different circuits based on their specific functional requirements. The power amplifier circuit uses a first semiconductor material optimized for amplification performance, while the switch circuit uses a second semiconductor material optimized for switching characteristics. This localized material selection improves overall system performance while the patent manages manufacturing complexity through a standardized substrate and conductor structure.
Data Source
AI summary
A radio frequency module includes a module substrate having major surfaces that face each other, a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed, a second base part that is at least partially comprised of a second semiconductor material different from the first semiconductor material and in which a power amplifier is formed, and a switch connected to an output terminal of the power amplifier. The first base part is disposed on or over the major surface; the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode; and the switch is disposed on or over the major surface.