Multi-band Sensor Array on Single Optical Plane
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Solution Overview
Problem
Current remote sensing instruments (RSI) require complex and bulky designs due to the integration of CCD sensors with CMOS-based circuitry, operating in extreme thermal, structural, and mechanical conditions, necessitating a simpler, more compact, and cost-effective solution with a broader wavelength range and easier manufacturing.
Innovation Solution
A multi-band sensor array is designed with one panchromatic sensor and four color-band sensors packaged on a single optical plane, using wafer butting technology to form elongated sensors and ceramic packaging with LVDS matching and capacitance networks to reduce noise, coupled with hard and soft printed circuit boards for thermal and mechanical resilience.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If folding mirrors are used to guide different ray traces to different optical planes, then multiple sensor arrays can be positioned, but the optical system becomes very complicated and bulky
Solution Approach 1:
The patent combines panchromatic and multi-spectral sensor arrays onto a single optical plane, eliminating the need for folding mirrors and multiple independent optical paths. This merging of previously separate optical systems into one unified plane directly reduces optical complexity while maintaining multi-band sensing capability.
Solution Approach 2:
The sensor module is designed to perform multiple functions (panchromatic and multi-spectral sensing) within a single integrated structure on one optical plane, allowing one system to replace what previously required multiple separate systems with folding mirrors.
2Measurement precision
If CCD sensors are integrated with CMOS-based circuitry, then sensing performance is improved, but manufacturing becomes very complicated and costly
Solution Approach 1:
The patent uses CMOS-based sensors throughout the system, creating a homogeneous sensor technology platform. This eliminates the complexity of integrating different sensor types (CCD and CMOS) while maintaining high sensing performance and simplifying manufacturing processes.
3Reliability
If RSI is designed for space operation with thermal and mechanical extremes considered, then reliability is improved, but the design becomes bulky and difficult to manufacture
Solution Approach 1:
The patent employs ceramic packaging which provides excellent thermal stability and mechanical strength suitable for space environments. The ceramic material properties (thermal expansion coefficient, mechanical strength) are selected to match the sensor requirements, allowing reliable space operation without excessive structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the optical system, reduces manufacturing costs, enhances performance, and allows for easier operation in harsh environments, while maintaining high resolution and broad wavelength capabilities.
Implementation Method 1
Passive remote sensing detects natural radiation that is emitted or reflected by the object or surrounding areas. Reflected sunlight is the most common source of radiation measured by passive sensors.
Implementation Method 2
charge-coupled devices (CCD), and radiometers
Implementation Method 3
Passive remote sensing detects natural radiation that is emitted or reflected by the object or surrounding areas. Reflected sunlight is the most common source of radiation measured by passive sensors.
Implementation Method 4
charge-coupled devices (CCD), and radiometers
Implementation Method 5
RADAR is an example of active remote sensing, where the time delay between emission and return is measured, establishing the location, height, speed and direction of an object being radiated by the emitted energy (electromagnetic waves).
Data Source
AI summary
Designs of multi-band sensor array to generate multi-spectral images are disclosed. According to one aspect of the present invention, a multi-band sensor array includes one linear sensor configured to sense a scene in panchromatic spectrum to produce a panchromatic (PAN) sensing signal, and four color-band linear sensors to sense the same scene in different color bands to produce respective sensing signals. These sensors are packaged in a single module that is disposed on a single optical plane when used to scan a scene. A multi-spectral image is produced by combining these sensing signals. Further a unique packaging of the sensor array and a combination of soft and hard PCB are disclosed to withstand extremes in a harsh environment.