Multi-Beam Laser Debonding for Uniform Solder Heating
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Solution Overview
Problem
Conventional laser debonding apparatuses cause damage to electronic components and substrates due to temperature deviations resulting from the energy density of a single laser beam, leading to overheating and defects during the debonding process.
Innovation Solution
A multi-beam laser debonding apparatus employing a first laser module to pre-heat a larger area and a second laser module to heat a smaller area specifically around the debonding target, allowing for precise control of temperature profiles to prevent overheating and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single laser beam is used for debonding, then the debonding process can be performed with simple equipment, but temperature deviations occur causing overheating of electronic components
Solution Approach 1:
The single laser beam is divided into multiple laser beams (first laser beam, second laser beam, third laser beam) that are emitted at different angles and positions. This segmentation allows different regions of the substrate to receive appropriate heat energy, preventing temperature deviations and overheating while maintaining debonding effectiveness.
2Manufacturing precision
If a single high-power laser beam is used to reach debonding temperature, then debonding can be achieved, but neighboring electronic components are damaged due to excessive heat
Solution Approach 1:
Different laser beams are directed at specific locations and angles to create localized heating zones. The first laser beam provides base heating, while the second and third laser beams provide additional heating at specific angles to reach the debonding temperature precisely at the target location without overheating surrounding electronic components.
Solution Approach 2:
The system dynamically controls multiple laser beams with different power levels and emission angles. The controller adjusts the intensity and timing of each laser beam based on the specific requirements of the debonding location, enabling precise temperature control that prevents damage to neighboring components while achieving effective debonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-beam approach reduces temperature deviations, preventing damage to electronic components and substrates by fine-tuning the temperature profile, ensuring effective debonding without overheating neighboring components.
Implementation Method 1
a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature
Implementation Method 2
a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting
Data Source
Figure 1~2A
Figure 2B~2C
Figure 3~4A
AI summary
Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.