Multi-Cavity Load Lock Chamber for High-Throughput Wafer Transfer
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Solution Overview
Problem
The existing load lock chambers in semiconductor manufacturing processes face challenges in increasing substrate throughput and efficiency during the transfer of wafers between atmospheric and vacuum environments, as they often require altering the vacuum environment, which affects processing efficiency.
Innovation Solution
A symmetric load lock chamber with multiple layers and internal conduits for gas refilling and exhaustion, along with wafer supports that include grooves for machine arm calibration, allows for efficient transfer and processing of wafers without altering the vacuum environment, enhancing loading and unloading speed and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a traditional load lock chamber is used to transfer wafers from atmospheric to vacuum environment, then the wafer transfer function is achieved, but the vacuum environment must be altered which reduces processing efficiency
Solution Approach 1:
The load lock chamber is divided into multiple independent cavities (first cavity and second cavity) that can operate independently. Each cavity can be evacuated and maintained at vacuum separately, allowing one cavity to be loaded while another is being evacuated, thus maintaining overall vacuum stability while increasing throughput
Solution Approach 2:
The invention transitions from a single-chamber load lock to a multi-cavity structure, adding spatial dimensionality. This allows parallel operation of multiple cavities at different pressure states, enabling continuous wafer transfer without compromising the main vacuum environment
2Productivity
If the loading speed of wafers is increased to improve throughput, then substrate throughput is improved, but the complexity of the load lock chamber structure increases
Solution Approach 1:
The chamber body is segmented into multiple cavities with shared walls, where internal conduits are integrated into the shared walls. This segmentation allows parallel wafer loading while keeping the structural complexity manageable through modular design
Solution Approach 2:
Multiple cavities share common walls and integrated internal conduits for gas refilling and exhaustion. This merging of functions reduces the overall number of separate components compared to having completely independent chambers, thus controlling complexity while enabling parallel operations
3Productivity
If multiple cavities are added to increase wafer transfer capacity, then substrate throughput is improved, but the gas refilling and exhaustion system becomes more complex
Solution Approach 1:
Adjacent cavities share common walls with integrated internal conduits. This allows multiple cavities to share gas refilling and exhaustion pathways through the shared walls, reducing the total number of separate conduit systems needed while maintaining the ability to independently control each cavity's pressure
Data Source
AI summary
Disclosed is a load lock chamber which includes a chamber body including: at least one pair of cavities, defined in a layer structure of the chamber body to carry one or more wafer substrates; at least one internal conduit, defined between and coupled with the paired cavities, such that the paired cavities are communicated with each other and capable of conducting gas refilling and exhaustion; and a plurality of wafer supports for carrying the wafer substrates, the plurality of wafer supports being securely received in the paired cavities and able to calibrate with a machine arm frontend finger, wherein the wafer support includes grooves defined thereon for calibrating the machine arm frontend finger.