Multi-Package Coherent Transceiver Segmentation
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Solution Overview
Problem
Current multi-channel coherent transceivers face challenges in packaging and interconnecting components efficiently, leading to increased RF connections, complexity, and cooling costs, which affect signal quality and scalability.
Innovation Solution
A multi-package configuration where a tunable laser array is packaged separately from a photonic integrated circuit (PIC) and application-specific integrated circuit (ASIC), with an optical fiber array connecting them, allowing for reduced RF connections and simplified cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If components are packaged together in a single package, then device integration is improved, but RF connections and cooling complexity increase
Solution Approach 1:
The transceiver is divided into two separate packages: Package 1 contains the PIC and ASIC, while Package 2 contains the tunable laser array. This segmentation reduces RF connections and simplifies cooling requirements for each individual package while maintaining functional integration through optical fiber coupling.
2Ease of manufacture
If a single package is used for all components, then manufacturing simplicity is improved, but scalability and cost-effectiveness deteriorate
Solution Approach 1:
By separating the laser array into its own package, the system enables independent manufacturing and testing of each package module. This modular approach improves scalability by allowing parallel production and reduces costs through specialized manufacturing processes for each package type.
Solution Approach 2:
The optical fiber array is nested within the mechanical coupling structure that connects Package 1 and Package 2. This nested configuration allows for compact integration while maintaining the benefits of separate packaging, enabling scalable deployment by adding more optical fibers for additional channels.
3Reliability
If components are closely integrated, then signal transmission quality is improved, but cooling requirements and complexity increase
Solution Approach 1:
Separating heat-generating components (laser array) from sensitive electronic components (PIC and ASIC) into different packages allows each package to have optimized cooling solutions. This maintains signal quality through direct optical coupling while reducing thermal management complexity for each individual package.
Data Source
AI summary
A multi-channel optical transceiver is disclosed. The optical transceiver has a multi-package structure. A laser array is disposed in one package. An application specific integrated circuit (ASIC) and photonic integrated circuit (PIC) are disposed in another package. An optical fiber array may couple the first package and second package together.