Multi-Chip Package Structure Using Central Stiff Bonding
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Solution Overview
Problem
Semiconductor package structures experience warpage and cracking during thermal processes due to low rigidity, leading to potential damage of circuit layers and decreased yield.
Innovation Solution
A package structure incorporating a stiff bonding material between electronic devices, which is distinct from the underfills, to enhance rigidity and reduce warpage, along with a manufacturing method involving the application of underfills and stiff bonding material to create a rigid assembly structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic devices are integrated in a semiconductor package structure, then electrical performance and functions are improved, but warpage and cracking occur during thermal processes due to low rigidity
Solution Approach 1:
The patent uses a composite material system consisting of stiff bonding material (with higher Young's modulus) and underfill material (with lower Young's modulus) to create a multi-material structure. The stiff bonding material provides rigidity to prevent warpage and cracking, while the underfill material provides flexibility and stress relief, resolving the contradiction between needing rigidity for structural stability and flexibility for thermal stress management
2Stability of the object's composition
If the rigidity of the semiconductor package structure is increased to prevent warpage, then structural stability is improved, but the structure becomes more susceptible to cracking under thermal stress
Solution Approach 1:
The patent applies different material properties to different regions: the stiff bonding material is placed in the central gap between electronic devices where rigidity is most needed to prevent warpage, while the underfill material is applied around the periphery where flexibility and stress absorption are more important. This spatial differentiation of material properties resolves the contradiction between structural stability and crack resistance
3Strength
If a stiff bonding material is added to enhance rigidity, then warpage is reduced, but the device complexity increases
Solution Approach 1:
The patent segments the bonding material into two distinct types with different functions: stiff bonding material for central regions requiring rigidity, and underfill material for peripheral regions requiring flexibility. This segmentation allows each material to be optimized for its specific function while working together as an integrated system, managing complexity through functional differentiation
Data Source
AI summary
A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.